公开(公告)号：US20100218784A1

公开(公告)日：2010-09-02

申请号：US12783391

申请日：2010-05-19

申请人： CHEN-AN CHEN ,  Anh N. Nguyen ,  Manoocher Birang

发明人： CHEN-AN CHEN ,  Anh N. Nguyen ,  Manoocher Birang

IPC分类号： G01N21/55 ,  B08B7/04

CPC分类号： H01L21/6708 ,  H01L21/67253

摘要： Embodiments of the invention generally provide apparatus and method for detecting and controlling edge bevel removal of a semiconductor substrate. One embodiment of the present invention provides an apparatus for inspecting a rotating substrate. The apparatus comprises a substrate support configured to support the rotating substrate on a back side and rotate the substrate about a central axis, and a sensor positioned above the substrate support, the sensor being configured to inspect a front side of the rotating substrate while moving simultaneously radially across the substrate.

摘要翻译： 本发明的实施例通常提供用于检测和控制半导体衬底的边缘斜面去除的装置和方法。 本发明的一个实施例提供一种用于检查旋转基片的装置。 该装置包括：衬底支撑件，被配置为在后侧支撑旋转衬底并围绕中心轴线旋转衬底;以及位于衬底支撑件上方的传感器，该传感器被配置为在同时移动的同时检查旋转衬底的前侧 径向穿过衬底。