公开(公告)号：US11687168B2

公开(公告)日：2023-06-27

申请号：US17685281

申请日：2022-03-02

Applicant: CANON KABUSHIKI KAISHA

Inventor： Hiroaki Kobayashi

IPC: G06F3/16 ,  G06F3/023 ,  G06F3/04886 ,  G06F9/455 ,  H04N1/00

CPC classification number: G06F3/0236 ,  G06F3/04886 ,  G06F9/45558 ,  H04N1/00411 ,  G06F2009/45579

Abstract: In a case where an input field is selected, an information processing apparatus determines whether a remote operation is being performed, and based on a state of the remote operation, the information processing apparatus displays or hides a software keyboard of the information processing apparatus.

公开(公告)号：US20220291757A1

公开(公告)日：2022-09-15

申请号：US17685281

申请日：2022-03-02

Applicant: CANON KABUSHIKI KAISHA

Inventor： Hiroaki Kobayashi

IPC: G06F3/023 ,  G06F3/04886 ,  H04N1/00 ,  G06F9/455

Abstract: In a case where an input field is selected, an information processing apparatus determines whether a remote operation is being performed, and based on a state of the remote operation, the information processing apparatus displays or hides a software keyboard of the information processing apparatus.

公开(公告)号：US20220059597A1

公开(公告)日：2022-02-24

申请号：US17520199

申请日：2021-11-05

Applicant: CANON KABUSHIKI KAISHA

Inventor： Tsutomu Tange ,  Takumi Ogino ,  Hiroaki Kobayashi

IPC: H01L27/146 ,  H01L23/00

Abstract: A first conductive portion includes a first pad surrounded by a first insulator film in a plane perpendicular to a first direction, and a first via connected to the first pad so that the first via is positioned between the first pad and a first semiconductor layer in the first direction. A second conductive portion includes a second pad surrounded by a second insulator film in a plane perpendicular to the first direction, and a second via connected to the second pad so that the second via is positioned between the second pad and a second semiconductor layer in the first direction. The first and the second conductive portions are different in dimension.

公开(公告)号：US11249698B2

公开(公告)日：2022-02-15

申请号：US17029131

申请日：2020-09-23

Applicant: CANON KABUSHIKI KAISHA

Inventor： Hiroaki Kobayashi

IPC: G06F3/12

Abstract: In a case where a print job that is not performed according to designation of an object is included in print jobs stored in association with identification information of an authenticated user, an image processing apparatus gives notification that the print job that is not performed according to the designation of the object is included, to the authenticated user.

公开(公告)号：US20210167113A1

公开(公告)日：2021-06-03

申请号：US17175447

申请日：2021-02-12

Applicant: CANON KABUSHIKI KAISHA

Inventor： Tatsuya Ryoki ,  Hirofumi Totsuka ,  Masahiro Kobayashi ,  Hideaki Ishino ,  Hiroaki Kobayashi

IPC: H01L27/146 ,  H01L27/148

Abstract: A semiconductor device in which a first chip and a second chip are stacked including a first wiring line and a second wiring line by which the first chip and the second chip are electrically connected. The first wiring line and the second wiring line each include a bonding portion for bonding one of a plurality of conductive patterns placed in the first chip and one of a plurality of conductive patterns placed in the second chip. The number of bonding portions included in the first wiring line is larger than the number of bonding portions included in the second wiring line.

公开(公告)号：US10811455B2

公开(公告)日：2020-10-20

申请号：US16142997

申请日：2018-09-26

Applicant: CANON KABUSHIKI KAISHA

Inventor： Hiroaki Kobayashi ,  Atsushi Furubayashi ,  Katsuhito Sakurai

IPC: H01L27/14 ,  H01L27/146 ,  H04N5/369 ,  H04N5/378 ,  H04N5/3745

Abstract: A semiconductor apparatus includes a stack of a first chip having a plurality of pixel circuits arranged in a matrix form and a second chip having a plurality of electric circuit arranged in a matrix form. A wiring path between a semiconductor element configuring the pixel circuit and a semiconductor element configuring the electric circuit or a positional relationship between a semiconductor element configuring the pixel circuit and a semiconductor element configuring the electric circuit is differentiated among the electric circuits.

公开(公告)号：US09825086B2

公开(公告)日：2017-11-21

申请号：US14810285

申请日：2015-07-27

Applicant: CANON KABUSHIKI KAISHA

Inventor： Yuki Kawahara ,  Hiroaki Kobayashi

IPC: H01L27/00 ,  H01L27/146 ,  H01L27/30

CPC classification number: H01L27/14689 ,  H01L27/14612 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/1463 ,  H01L27/14636 ,  H01L27/14665 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/307

Abstract: An image pickup apparatus includes a first pixel electrode connected to a pixel circuit, a second pixel electrode adjoining the first pixel electrode and connected to the pixel circuit, a photoelectric conversion film continuously covering the first and second pixel electrodes, and an opposite electrode facing the first and second pixel electrodes via the film. The film includes a recessed portion recessed toward a portion between the first and second pixel electrodes on a surface opposite to the first and second pixel electrodes. The depth of the recessed portion is greater than the first pixel electrode's thickness, and a distance from the first pixel electrode to the recessed portion is greater than a distance from the first pixel electrode to the second pixel electrode. The opposite electrode is provided continuously along the surface via the film, and the recessed portion surrounds a part of the opposite electrode.

公开(公告)号：US20240371908A1

公开(公告)日：2024-11-07

申请号：US18778669

申请日：2024-07-19

Applicant: CANON KABUSHIKI KAISHA

Inventor： Hiroaki Kobayashi ,  Atsushi Furubayashi ,  Katsuhito Sakurai

IPC: H01L27/146 ,  H04N25/75 ,  H04N25/778 ,  H04N25/79

Abstract: A semiconductor apparatus includes a stack of a first chip having a plurality of pixel circuits arranged in a matrix form and a second chip having a plurality of electric circuit arranged in a matrix form. A wiring path between a semiconductor element configuring the pixel circuit and a semiconductor element configuring the electric circuit or a positional relationship between a semiconductor element configuring the pixel circuit and a semiconductor element configuring the electric circuit is differentiated among the electric circuits.

公开(公告)号：US11855116B2

公开(公告)日：2023-12-26

申请号：US17520199

申请日：2021-11-05

Applicant: CANON KABUSHIKI KAISHA

Inventor： Tsutomu Tange ,  Takumi Ogino ,  Hiroaki Kobayashi

IPC: H01L27/146 ,  H01L23/00

CPC classification number: H01L27/14636 ,  H01L24/05 ,  H01L27/14643 ,  H01L27/14689

Abstract: A first conductive portion includes a first pad surrounded by a first insulator film in a plane perpendicular to a first direction, and a first via connected to the first pad so that the first via is positioned between the first pad and a first semiconductor layer in the first direction. A second conductive portion includes a second pad surrounded by a second insulator film in a plane perpendicular to the first direction, and a second via connected to the second pad so that the second via is positioned between the second pad and a second semiconductor layer in the first direction. The first and the second conductive portions are different in dimension.

公开(公告)号：US20230068979A1

公开(公告)日：2023-03-02

申请号：US17881669

申请日：2022-08-05

Applicant: CANON KABUSHIKI KAISHA

Inventor： Hiroaki Kobayashi

IPC: G06F3/12

Abstract: Provided is a method for controlling an information processing apparatus transmitting print data and a print setting to an image forming apparatus, the method comprising storing a plurality of print settings and displaying a selection screen to select a print setting for print data transmitted to the image forming apparatus among the stored plurality of print settings to receive the selected print setting by a user, wherein the plurality of print settings displayed on the selection screen are controlled based on a type of the print data.