公开(公告)号：US09119302B2

公开(公告)日：2015-08-25

申请号：US13781863

申请日：2013-03-01

Applicant: CANON COMPONENTS, INC.

Inventor： Yoshihiro Hattori ,  Shozo Asai

IPC: H05K1/00 ,  H05K1/02 ,  H05K3/40 ,  H05K1/03

CPC classification number: H05K1/0277 ,  H01L23/13 ,  H01L23/142 ,  H01L23/367 ,  H01L23/4985 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K3/4092 ,  H05K2203/1545 ,  H01L2924/00

Abstract: A flexible circuit board includes a base film formed by a metallic material, a first protective film formed on a first surface of the base film, and a circuit pattern adhered to the first protective film through an adhesive film. Projections and recesses for heat release are formed on a second surface that is a surface on the opposite side of the first surface of the base film.

Abstract translation: 柔性电路板包括由金属材料形成的基膜，形成在基膜的第一表面上的第一保护膜和通过粘合膜粘附到第一保护膜的电路图案。 用于放热的突起和凹部形成在作为基膜的第一表面的相对侧上的表面的第二表面上。

公开(公告)号：US10011129B2

公开(公告)日：2018-07-03

申请号：US15618411

申请日：2017-06-09

Applicant: CANON COMPONENTS, INC.

Inventor： Masashi Ishimaru ,  Yoshihisa Negishi ,  Kenichi Matsumoto ,  Yoshihiro Hattori

IPC: B41J13/00 ,  B65H7/14 ,  B65H5/06 ,  G03G15/00 ,  B41J11/00 ,  G01N21/86

CPC classification number: B41J13/0009 ,  B41J11/0095 ,  B65H5/062 ,  B65H7/14 ,  G01N21/86 ,  G03G15/5025 ,  G03G15/6529 ,  G03G15/6555

Abstract: Provided is a control unit of a conveying apparatus, the conveying apparatus including: a conveying unit that conveys recording paper along a conveyance path; an imaging unit that images the recording paper; and a light emitting unit arranged on an opposite side of the imaging unit across the conveyance path, wherein the control unit detects conveyance information of the recording paper based on image information of the recording paper imaged by the imaging unit in a state in which light from the light emitting unit is transmitted through the recording paper. The control unit detects the conveyance information of the recording paper based on a plurality of images of the recording paper imaged at different timings by the imaging unit.

公开(公告)号：US10536604B2

公开(公告)日：2020-01-14

申请号：US15937223

申请日：2018-03-27

Applicant: CANON COMPONENTS, INC.

Inventor： Yoshihiro Hattori ,  Hiroyuki Murakami ,  Junichi Kato

IPC: H04N1/03 ,  G02B13/00

Abstract: A line sensor apparatus comprises a rod lens array in which a plurality of rod lenses are arrayed in a first direction, a line sensor substrate including a line sensor which receives light from the rod lens array, a pair of inner supporting members configured to support the line sensor substrate, a transmitter substrate including a transmitter which transfers data based on the light detected by the line sensor, and an outer supporting member configured to support the pair of inner supporting members and the transmitter substrate, wherein the pair of inner supporting members are arranged on two side surfaces of the rod lens array in a second direction perpendicular to the first direction.

公开(公告)号：US09072182B2

公开(公告)日：2015-06-30

申请号：US13781863

申请日：2013-03-01

Applicant: CANON COMPONENTS, INC.

Inventor： Yoshihiro Hattori ,  Shozo Asai

IPC: H05K1/00 ,  H05K1/02 ,  H05K3/40 ,  H05K1/03

Abstract: A flexible circuit board includes a base film formed by a metallic material, a first protective film formed on a first surface of the base film, and a circuit pattern adhered to the first protective film through an adhesive film. Projections and recesses for heat release are formed on a second surface that is a surface on the opposite side of the first surface of the base film.

公开(公告)号：US09745428B2

公开(公告)日：2017-08-29

申请号：US14455324

申请日：2014-08-08

Applicant: CANON COMPONENTS, INC.

Inventor： Taisuke Iwashita ,  Yoshihisa Negishi ,  Yoshihiro Hattori ,  Naoki Tatebayashi

IPC: C08F2/46 ,  C08F2/50 ,  C08G61/04 ,  C08J3/28 ,  H05K1/03 ,  H05K3/18 ,  C08J7/12 ,  C23C18/16 ,  C23C18/20 ,  H05K3/38 ,  C23C18/48

CPC classification number: C08J3/28 ,  C08J7/123 ,  C08J2345/00 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/2006 ,  C23C18/204 ,  C23C18/2086 ,  C23C18/48 ,  H05K1/032 ,  H05K3/182 ,  H05K3/185 ,  H05K3/381 ,  H05K2203/107 ,  Y10T428/24612 ,  Y10T428/31692

Abstract: There is provided with a method for manufacturing a resin product. One embodiment includes performing a modification process on a portion of a surface of the resin product not less than two times by different methods to modify the portion such that a plating metal can be deposited on the portion.