公开(公告)号：US20140210083A1

公开(公告)日：2014-07-31

申请号：US14229215

申请日：2014-03-28

Applicant: Broadcom Corporation

Inventor： Sam Ziqun Zhao ,  Reza-ur Rahman Khan ,  Edward Law ,  Marc Papageorge

IPC: H01L23/00 ,  H01L23/12

CPC classification number: H01L24/48 ,  H01L23/16 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/32 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48237 ,  H01L2224/484 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: In one embodiment, a device package is provided. The device package can include a substrate having first and second opposing surfaces, an opening being formed through the first and second surfaces of the substrate; a stiffener coupled to the first surface of the substrate, the stiffener having an extending portion that extends into the opening of the substrate; and an integrated circuit (IC) die coupled to the extending portion of the stiffener, the IC die being electrically coupled to the substrate.

Abstract translation: 在一个实施例中，提供了一种设备包。 器件封装可以包括具有第一和第二相对表面的衬底，通过衬底的第一和第二表面形成的开口; 加强件，其耦合到所述基板的所述第一表面，所述加强件具有延伸到所述基板的开口中的延伸部分; 以及耦合到所述加强件的所述延伸部分的集成电路（IC）管芯，所述IC管芯电耦合到所述衬底。