HIGHLY CROSSLINKED POLYMER DIELECTRIC FILMS FOR IMPROVED CAPACITOR PERFORMANCE
    2.
    发明申请
    HIGHLY CROSSLINKED POLYMER DIELECTRIC FILMS FOR IMPROVED CAPACITOR PERFORMANCE 有权
    用于改进电容器性能的高交织聚合物电介质膜

    公开(公告)号:US20140362493A1

    公开(公告)日:2014-12-11

    申请号:US14292349

    申请日:2014-05-30

    Inventor: Marc Weimer

    CPC classification number: C08F120/58 H01G4/18 H01G4/32 Y10T428/31855

    Abstract: New polymeric dielectric materials are provided for high power capacitors, especially for mobile and weapons applications. These materials utilize aminoplast crosslinking in their polymeric structure. The aminoplast crosslinking ability of these materials allows them to be customized for a number of applications, but also allows the materials to have a higher crosslinking density, leading to higher dielectric constants, higher breakdown voltage, and higher thermal stability. These materials can be incorporated into current capacitor manufacturing schemes with little to no processing changes.

    Abstract translation: 为高功率电容器提供了新的聚合介电材料,特别适用于移动和武器应用。 这些材料在其聚合物结构中利用氨基塑料交联。 这些材料的氨基塑料交联能力使得它们可以针对多种应用进行定制,而且还允许材料具有更高的交联密度,导致更高的介电常数,更高的击穿电压和更高的热稳定性。 这些材料可以结合到电流电容器制造方案中,几乎没有处理变化。

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