Pressure equalization in earphones
    3.
    发明授权
    Pressure equalization in earphones 有权
    耳机压力均衡

    公开(公告)号:US09301040B2

    公开(公告)日:2016-03-29

    申请号:US14211556

    申请日:2014-03-14

    申请人: Bose Corporation

    IPC分类号: H04R1/10 H04R1/28

    摘要: A headphone includes an electro-acoustic transducer dividing an enclosed volume into a front volume and a rear volume, a first port in the housing coupling the front volume to an ear canal of a user, a second port in the housing coupling the front volume to space outside the ear, a third port in the housing coupling the rear volume to space outside the ear, and an ear tip configured to surround the first port and including a flap to seal the ear canal from space outside the ear. The second port has a diameter and a length that provide an acoustic mass with an acoustic impedance with a high reactive component and a low resistive component, reducing the occlusion effect that otherwise results from sealing the ear.

    摘要翻译: 耳机包括将封闭容积分成前容积和后体积的电声换能器,所述壳体中的第一端口将所述前体积耦合到使用者的耳道,所述壳体中的第二端口将所述前体积耦合到 外壳之外的空间,壳体中的第三端口将后部体积耦合到耳朵外部的空间,以及耳塞,其构造成围绕第一端口并且包括用于将耳道从耳朵外侧的空间密封的瓣。 第二端口具有直径和长度,其提供具有高反应分量和低电阻分量的声阻抗的声学质量,从而降低由于密封耳朵而导致的闭塞效应。

    Earpiece positioning and retaining

    公开(公告)号:US08712089B2

    公开(公告)日:2014-04-29

    申请号:US14084143

    申请日:2013-11-19

    申请人: Bose Corporation

    IPC分类号: H04R25/00

    摘要: A positioning and retaining structure for an in-ear earpiece. An outer leg and an inner leg are attached to each other at an attachment end and attached to a body of the earpiece at the other end. The outer leg lies in a plane. The positioning and retaining structure have a stiffness that is greater when force is applied to the attachment end in a counterclockwise direction in the plane of the outer leg than when force is applied to the attachment end in a clockwise direction in the plane of the outer leg. The positioning and retaining structure position an earpiece associated with the earpiece in a users ear and retains the earpiece in its position.

    Earphones
    10.
    发明授权

    公开(公告)号:US10327062B2

    公开(公告)日:2019-06-18

    申请号:US15704244

    申请日:2017-09-14

    申请人: BOSE CORPORATION

    IPC分类号: H04R1/10 H04R1/24 H04R1/28

    摘要: A headphone includes a housing defining an enclosed volume, an electro-acoustic transducer dividing the enclosed volume into a front volume and a rear volume, a first port in the housing coupling the front volume to an ear canal of a user, a second port in the housing coupling the front volume to space outside the ear, a third port in the housing coupling the rear volume to space outside the ear, and an ear tip configured to surround the first port and seal the ear canal from space outside the ear. The second port has a diameter and a length that provide an acoustic mass with an acoustic impedance with a high reactive component and a low resistive component.