公开(公告)号：US20080139074A1

公开(公告)日：2008-06-12

申请号：US11867958

申请日：2007-10-05

申请人： Bong Hwan CHOI ,  Seok Hee Shim

发明人： Bong Hwan CHOI ,  Seok Hee Shim

IPC分类号： H01J9/00

CPC分类号： F16J15/02 ,  G02F1/1333 ,  G02F2001/133354 ,  H01J9/241 ,  H01J9/261 ,  H01J17/16 ,  H01J17/49

摘要： An apparatus for attaching substrates includes a first chamber for supporting a first substrate and a second chamber for supporting a second substrate. A main seal member is placed between the first chamber and the second chamber so as to maintain a seal and a gap between the chambers. An alignment control part is placed between the first chamber and the second chamber so as to maintain the seal, and also to allow the second chamber to move with respect to the first chamber in order to align the substrates. The alignment control part may also control a gap between the chambers, to thereby maintain a uniform gap between the substrates.

摘要翻译： 一种用于安装基板的装置包括用于支撑第一基板的第一室和用于支撑第二基板的第二室。 主密封构件被放置在第一腔室和第二腔室之间，以便保持腔室之间的密封和间隙。 对准控制部分被放置在第一室和第二室之间以便​​保持密封，并且还允许第二室相对于第一室移动以便对准衬底。 对准控制部分还可以控制室之间的间隙，从而在基板之间保持均匀的间隙。

公开(公告)号：US20130181407A1

公开(公告)日：2013-07-18

申请号：US13784159

申请日：2013-03-04

申请人： Bong Hwan CHOI ,  Seok Hee SHIM

发明人： Bong Hwan CHOI ,  Seok Hee SHIM

IPC分类号： F16J15/02

CPC分类号： F16J15/02 ,  G02F1/1333 ,  G02F2001/133354 ,  H01J9/241 ,  H01J9/261 ,  H01J17/16 ,  H01J17/49

摘要： An apparatus for attaching substrates includes a first chamber for supporting a first substrate and a second chamber for supporting a second substrate. A main seal member is placed between the first chamber and the second chamber so as to maintain a seal and a gap between the chambers. An alignment control part is placed between the first chamber and the second chamber so as to maintain the seal, and also to allow the second chamber to move with respect to the first chamber in order to align the substrates. The alignment control part may also control a gap between the chambers, to thereby maintain a uniform gap between the substrates.

摘要翻译： 一种用于安装基板的装置包括用于支撑第一基板的第一室和用于支撑第二基板的第二室。 主密封构件被放置在第一腔室和第二腔室之间，以便保持腔室之间的密封和间隙。 对准控制部分被放置在第一室和第二室之间以便​​保持密封，并且还允许第二室相对于第一室移动以便对准衬底。 对准控制部分还可以控制室之间的间隙，从而在基板之间保持均匀的间隙。

公开(公告)号：US20090114350A1

公开(公告)日：2009-05-07

申请号：US12260652

申请日：2008-10-29

申请人： Dong Gun KIM ,  Bong Hwan CHOI

发明人： Dong Gun KIM ,  Bong Hwan CHOI

IPC分类号： B29C65/78

CPC分类号： G02F1/133 ,  G02F1/1303 ,  Y10T156/107 ,  Y10T156/1744

摘要： A substrate bonding apparatus and method are provided. The substrate bonding apparatus may include a first support member that receives a first substrate, a second support member that receives a second substrate opposite the first support member, and a support pin located at the outside of the first substrate fixed to the first support member. The support pin may be connected to the first support member, and a distance adjustment device may move the support pin upward or downward to adjust the distance between the first support member and the second support member.

摘要翻译： 提供了一种基板接合装置和方法。 基板接合装置可以包括接收第一基板的第一支撑构件，接收与第一支撑构件相对的第二基板的第二支撑构件和位于固定到第一支撑构件的第一基板的外侧的支撑销。 支撑销可以连接到第一支撑构件，并且距离调节装置可以将支撑销向上或向下移动以调节第一支撑构件和第二支撑构件之间的距离。