公开(公告)号：US09099569B2

公开(公告)日：2015-08-04

申请号：US14261633

申请日：2014-04-25

申请人： BSE CO., LTD.

发明人： Sang Ho Lee ,  Yong Hyun Shim

IPC分类号： H01L29/84 ,  H04R19/04 ,  B81B3/00 ,  B81B7/00

CPC分类号： H01L29/84 ,  B81B3/0021 ,  B81B7/0032 ,  B81B7/0035 ,  B81B7/0061 ,  H04R1/086 ,  H04R1/2807 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003 ,  H04R2499/11

摘要： A micro-electro mechanical system (MEMS) microphone includes: a printed circuit substrate; a MEMS chip that is combined with the printed circuit substrate and has a MEMS inner space; and a case that is combined with the printed circuit substrate, accommodates the MEMS chip, and forms an inner space that is separated from an external space, wherein the case is a double-type case including an inner case and an outer case, a medium acoustic path space is formed between the inner case and the outer case, and the printed circuit substrate includes a substrate acoustic path that connects the medium acoustic path space to the MEMS inner space of the MEMS chip so that external sound passing through the sound hole enters the MEMS inner space of the MEMS chip after passing through the medium acoustic path space.

摘要翻译： 微机电系统（MEMS）麦克风包括：印刷电路基板; 与印刷电路基板结合并具有MEMS内部空间的MEMS芯片; 以及与印刷电路基板结合的情况，容纳MEMS芯片，并且形成与外部空间分离的内部空间，其中壳体是包括内壳体和外壳体的双重情况，介质 在内壳和外壳之间形成声路空间，并且印刷电路基板包括将介质声路空间连接到MEMS芯片的MEMS内部空间的基板声道，使得通过声孔的外部声音进入 MEMS芯片的MEMS内部空间通过介质声道空间。