公开(公告)号：US20190051857A1

公开(公告)日：2019-02-14

申请号：US15982544

申请日：2018-05-17

Applicant: BOE Technology Group Co., Ltd.

Inventor： Pan XU ,  YI-CHENG LIN ,  Quanhu LI

IPC: H01L51/52 ,  H01L27/32 ,  H01L51/56

Abstract: This disclosure discloses an organic light-emitting diode encapsulation structure, a method for fabricating the same, and an organic light-emitting diode, and the organic light-emitting diode encapsulation structure includes: a cover plate; an array substrate arranged opposite to the cover plate; a spacing layer arranged on at least one of the surface of the edge of the array substrate facing the cover plate, and the surface of the edge of the cover plate facing the array substrate; and wherein the cover plate and the array substrate are bonded to each other through frame sealing glue affixed on the spacing layer into a box; and the surface of the spacing layer bonded through the frame sealing glue is structured in a concave-convex pattern.