Abstract:
The present disclosure discloses an OLED panel, a method for manufacturing the same and a display device. The OLED panel includes a substrate, a cover plate, an OLED device and an encapsulation structure. The encapsulation structure includes a thin-film encapsulation layer and an encapsulation adhesive, and a hydrochromic material is added in the encapsulation structure.
Abstract:
The present disclosure provides an organic light emitting display device and a method for packaging an organic light emitting diode. The organic light emitting display device includes a lower substrate, a thin film transistor (TFT) function layer, an organic light emitting diode, a thin film packaging layer and an upper substrate which are arranged on the lower substrate. The thin film packaging layer includes at least one completely-covering layer. The completely-covering layer covers completely the lower substrate which is provided with the TFT function layer and the organic light emitting diode. The thin film packaging layer according to the present disclosure has advantageous such as having a good water-blocking effect, being of a simple structure, and being suitable for a flexible organic light emitting display device.
Abstract:
An OLED packaging method, a packaged structure, and a display device. The packaging method comprises forming at least one group of films on an OLED to be packaged. Each group of films comprises three films, and an intermediate film in each group of films is an intermediate inorganic-organic hybrid layer. The packaged structure comprises at least one group of films; the at least one group of films encapsulates an OLED to be packaged. Each group of films comprises three films, and an intermediate film in each group of films is an intermediate inorganic-organic hybrid layer. The intermediate inorganic-organic hybrid layer is arranged as an intermediate film in each group of films, and connects an upper film and a lower film in each group of films, so that adhesion between the upper film and the lower film in each group of films is effectively improved, and stripping of the upper and lower films is avoided.