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1.发明公开公开(公告)号：US20240304762A1
公开(公告)日：2024-09-12
申请号：US18026332
申请日：2022-04-26
Inventor： Yutian CHU , Sha FENG , Zhijun XIONG , Yuanda LU , Liang SUN , Zhaohui LI , Enkai DONG , Jiacheng QI , Jinpeng LI , Qiqi ZHOU , Le WANG
CPC classification number: H01L33/46 , H01L33/62 , H01L2933/0025 , H01L2933/0066
Abstract: Provided are a light-emitting chip, a light-emitting substrate, a display device, and a manufacturing method for a light-emitting substrate. The light-emitting chip includes: a substrate; a light-emitting structure, the light-emitting structure disposed on a side of the substrate; a reflective layer disposed on a side, facing away from the substrate, of the light-emitting structure; at least two sub-light-emitting auxiliary bonding layers disposed on a side, facing away from the light-emitting structure, of the reflective layer; and a raised portion, disposed on a side, facing away from the light-emitting structure, of the reflective layer, an orthographic projection of the raised portion on the substrate and an orthographic projection of the sub-light-emitting auxiliary bonding layers on the substrate do not overlap with each other, and a thickness of the raised portion is smaller than a thickness of each of the at least two sub-light-emitting auxiliary bonding layers.
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公开(公告)号：US20240266470A1
公开(公告)日：2024-08-08
申请号：US18279310
申请日：2021-10-29
Inventor： Zhijun XIONG , Junjie MA , Yuanda LU , Jiawei ZHAO , Shanwei YANG , Yuanhao SUN , Xueqiao LI
IPC: H01L33/38 , H01L23/00 , H01L25/075
CPC classification number: H01L33/38 , H01L24/29 , H01L25/0753 , H01L2224/29019 , H01L2224/29021 , H01L2224/29111 , H01L2224/29194 , H01L2224/2957 , H01L2924/0132 , H01L2924/0133
Abstract: The present disclosure provides a light-emitting device, a light-emitting module and a preparation method thereof. The light-emitting device includes: a light-emitting structure; an electrode structure provided on the light-emitting structure; and a die-bonding structure, at least a portion of which covers a surface of the electrode structure facing away from the light-emitting structure, where the die-bonding structure includes a doping material for inhibiting generation of an intermetallic compound. The present disclosure is capable of improving the die-bonding rework yield and reducing the risk of failure of a display module.
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3.发明公开公开(公告)号：US20240213422A1
公开(公告)日：2024-06-27
申请号：US17920017
申请日：2021-10-28
Inventor： Jiawei ZHAO , Junjie MA , Zhijun XIONG , Shanwei YANG , Yuanhao SUN , Yuanda LU , Xueqiao LI
CPC classification number: H01L33/60 , H01L33/56 , H01L33/62 , H01L2933/005 , H01L2933/0058
Abstract: A light emitting device and a preparation method therefor, and a light emitting substrate and a preparation method therefor are provided. The light emitting device includes an underlay substrate, a light emitting functional layer disposed on the underlay substrate, and a reflective layer disposed on the underlay substrate and covering at least part of the light emitting functional layer, the reflective layer includes a first material layer and a second material layer, the first material layer and the second material layer are stacked along a thickness direction of the underlay substrate, the first material layer includes an atomic crystal material, the first material layer is at one side of the second material layer away from the underlay substrate, and a surface of the first material layer away from the second material layer is formed as a surface of the reflective layer away from the underlay substrate.
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公开(公告)号：US20220254969A1
公开(公告)日：2022-08-11
申请号：US17481326
申请日：2021-09-22
Inventor： Linxia QI , Junjie MA , Yuanda LU , Shanwei YANG , Jiawei ZHAO , Zhijun XIONG , Haiwei SUN , Lingyun SHI , Jinpeng LI
IPC: H01L33/62 , H01L25/075 , H01L33/38
Abstract: A light-emitting chip and a light-emitting substrate are provided. The light-emitting chip includes a base substrate and at least two sub-light-emitting chips disposed on a side of the base substrate, wherein each sub-light-emitting chip includes a first semiconductor layer, a second semiconductor layer and an light-emitting layer located between the first semiconductor layer and the second semiconductor layer which are stacked.
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公开(公告)号：US20250160086A1
公开(公告)日：2025-05-15
申请号：US19026805
申请日：2025-01-17
Inventor： Linxia QI , Junjie MA , Yuanda LU , Shanwei YANG , Jiawei ZHAO , Zhijun XIONG , Haiwei SUN , Lingyun SHI , Jinpeng LI
IPC: H10H20/857 , H01L25/075 , H10H20/831
Abstract: A light-emitting chip and a light-emitting substrate are provided. The light-emitting chip includes a base substrate and at least two sub-light-emitting chips disposed on a side of the base substrate, wherein each sub-light-emitting chip includes a first semiconductor layer, a second semiconductor layer and an light-emitting layer located between the first semiconductor layer and the second semiconductor layer which are stacked.
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Patent Agency Ranking
公开(公告)号：US20240213432A1
公开(公告)日：2024-06-27
申请号：US17918214
申请日：2021-10-29
Inventor： Shanwei YANG , Junjie MA , Yuanda LU , Zhijun XIONG , Linxia QI , Jiawei ZHAO , Yuanhao SUN
IPC: H01L33/64 , H01L25/075 , H01L33/38 , H01L33/62
CPC classification number: H01L33/642 , H01L25/0753 , H01L33/382 , H01L33/62 , H01L33/641 , H01L2933/0016 , H01L2933/0075
Abstract: The present disclosure provides a light emitting chip and a producing method thereof, and a light emitting apparatus. The light emitting chip includes a patterned substrate; a light emitting unit, wherein the light emitting unit includes an electron injection layer, a luminescent layer and a hole injection layer; a first electrode, wherein the first electrode is connected to the electron injection layer; a second electrode, wherein the second electrode is connected to the hole injection layer; a first passivation layer, wherein the first passivation layer partially covers the light emitting unit, the first electrode and the second electrode, the first passivation layer includes a first opening, and the light emitting unit partially exposes from the first opening; and a heat dissipating layer, wherein the heat dissipating layer covers the first passivation layer, and a part of the light emitting unit exposing from the first passivation layer.
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公开(公告)号：US20240363799A1
公开(公告)日：2024-10-31
申请号：US18579889
申请日：2021-09-29
Inventor： Yuanda LU , Shanwei YANG , Jiawei ZHAO , Zhijun XIONG , Yuanhao SUN , Xueqiao LI , Junjie MA
Abstract: Provided are a light-emitting device, a light-emitting substrate and a display device. The light-emitting device includes: a substrate; a first semiconductor layer, the first semiconductor layer being located on one side of the substrate; a light-emitting layer, the light-emitting layer being located on the side of the first semiconductor layer facing away from the substrate; and a second semiconductor layer, the second semiconductor layer being located on the side of the light-emitting layer facing away from the first semiconductor layer.
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公开(公告)号：US20190227222A1
公开(公告)日：2019-07-25
申请号：US16103984
申请日：2018-08-16
Inventor： Heling ZHU , Junjie MA , Yuanda LU , Bo HAN , Liang GAO , Lu YU , Pengfei CHENG
IPC: F21V8/00
Abstract: A light guide assembly comprises: a first light guide member; and a second light guide member stacked on the first light guide member. The light guide assembly has first and second light incident surfaces located on different sides, and a light emitting surface and a bottom surface which are oppositely disposed in a thickness direction, the first light incident surface and the bottom surface are located on the first light guide member, and the second light incident surface and the light emitting surface are located on the second light guide member, and the bottom surface is provided with first dots having a density increasing in a direction away from the first light incident surface, and the light emitting surface is provided with second dots having a density increasing in a direction away from the second light incident surface.
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公开(公告)号：US20210116623A1
公开(公告)日：2021-04-22
申请号：US16834092
申请日：2020-03-30
Inventor： Jinpeng Li , Ming Zhai , Pei Li , Zhiyuan Wang , Pengjun Cao , Jian Li , Teng Zhang , Zongying Shu , Yuanda LU , Linxia Qi , Pei Qin
Abstract: Disclosed are a backlight module and a display device. The backlight module includes: a substrate and light emitting devices disposed on a side of the substrate, where each of the light emitting devices includes a light emitting diode, and a first connecting weld leg and a second connecting weld leg disposed between the light emitting diode and the substrate; the backlight module further includes a reflective layer between the substrate and the light emitting diodes; and for a same light emitting device, an orthographic projection of the reflective layer on the substrate and an area between orthographic projections of the first connecting weld leg and the second connecting weld leg on the substrate have an overlapping area.
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公开(公告)号：US20200280662A1
公开(公告)日：2020-09-03
申请号：US16647644
申请日：2019-03-22
Inventor： Fei GAO , Xuerong WANG , Lingyun SHI , Lu YU , Lei CHEN , Junjie MA , Xuqing FENG , Pengfei CHENG , Xin MA , Yuanda LU , Haixu LI
Abstract: The present disclosure provides a floating touch camera module, a display device and a touch method. The floating touch camera module includes: a lens with a light collection surface and a light emitting surface; an image sensor at one side of the light emitting surface of the lens, the image sensor configured to receive light rays from the lens and form sensing information; and an infrared cut filter film at one side of a light incident surface of the image sensor and configured to filter out infrared light rays. The infrared cut filter film is movable relative to the lens between a first position at which the infrared cut filter film directly faces the lens and a second position at which the infrared cut filter film is offset from the lens, thereby enabling the floating touch camera module to switch between a photographing mode and a touch mode.
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