REFRIGERATION SYSTEM AND REFRIGERATION METHOD FOR DATA CENTER

    公开(公告)号:US20190208668A1

    公开(公告)日:2019-07-04

    申请号:US16226328

    申请日:2018-12-19

    Abstract: The present disclosure provides a refrigeration system and refrigeration method for a data center. The refrigeration system comprises: a first heat exchanger disposed on a back plate of an indoor cabinet of the data center, and a phase-change heat-exchange cooling tower disposed outdoor of the data center; the first heat exchanger and the phase-change heat-exchange cooling tower are communicated by a secondary refrigerant delivery pipeline; the secondary refrigerant delivery pipeline obtains a secondary refrigerant in liquid-state from the phase-change heat-exchange cooling tower and delivers the secondary refrigerant to the first heat exchanger, the secondary refrigerant absorbs heat on the first heat exchanger and becomes gas to refrigerate for the indoor of the data center where the first heat exchanger lies; the secondary refrigerant delivery pipeline further delivers the secondary refrigerant in gas-state to the phase-change heat-exchange cooling tower, and the phase-change heat-exchange cooling tower transfers heat carried in the secondary refrigerant into air and condenses the secondary refrigerant to a liquid again; the secondary refrigerant employs a phase-change heat-exchange working medium. The refrigeration system of the data center according to the present disclosure can easily achieve 100% refrigerator-free water-free highly-efficient and energy-saving refrigeration, has a simple structure and can reduce the maintenance costs.

    MACHINE CABINET
    2.
    发明申请
    MACHINE CABINET 审中-公开

    公开(公告)号:US20170359919A1

    公开(公告)日:2017-12-14

    申请号:US15279221

    申请日:2016-09-28

    CPC classification number: H05K7/208 H01L23/427 H05K7/20336 H05K7/20818

    Abstract: The present application discloses a machine cabinet. In one embodiment, the machine cabinet comprises a housing, and an inner chamber, a liquid working medium accommodating area, a heat exchanger and a delivery passage disposed in the housing, wherein the inner chamber is in a vacuum state and configured to accommodate electronic devices to be cooled; the liquid working medium accommodating area is configured to accommodate a liquid working medium, the liquid working medium is converted into a gas working medium to enter the heat exchanger after cooling the electronic devices to be cooled; the heat exchanger is configured to liquefy the gas working medium into a liquid working medium and guide the liquid working medium obtained by liquefying the gas working medium into the delivery passage; and the delivery passage is connected with the heat exchanger and the liquid working medium accommodating area and is configured to guide the liquid working medium obtained by liquefying the gas working medium into the liquid working medium accommodating area. The embodiment eliminates the influence of the humidity, cleanness and the like to the electronic devices due to the air circulation, and thus lengthens the service life of the electronic devices.

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