公开(公告)号：US20030211653A1

公开(公告)日：2003-11-13

申请号：US10455506

申请日：2003-06-05

Applicant: BAE SYSTEMS, Information and Electronic Systems Integration, Inc.

Inventor： Timothy Whalen ,  Santos H. Nazario-Camacho ,  Daniel S. Sherick

IPC: H01L021/44

CPC classification number: H01L23/49811 ,  H01L23/055 ,  H01L23/32 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01322 ,  H01L2924/1433 ,  H01L2924/15312 ,  H01L2924/16152 ,  H05K3/301 ,  H05K3/303 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2203/167 ,  Y02P70/613

Abstract: An apparatus for providing mechanical support to a column grid array package is disclosed. The column grid array package uses solder columns to provide electrical connections between a ceramic substrate and a printed circuit board. The ceramic substrate has two sides, with an integrated circuit chip mounted on one side and many input/output pads mounted on the other side. Solder columns are attached between the input/output pads and the printed circuit board. A corner post is located at each corner of the column grid array package to secure the position of the ceramic substrate in relation to the printed circuit board.

公开(公告)号：US20030209798A1

公开(公告)日：2003-11-13

申请号：US10142027

申请日：2002-05-09

Applicant: BAE Systems

Inventor： Timothy Whalen ,  Santos H. Nazario-Camacho ,  Daniel S. Sherick

IPC: H01L023/053 ,  H01L023/12

CPC classification number: H01L23/49811 ,  H01L23/055 ,  H01L23/32 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01322 ,  H01L2924/1433 ,  H01L2924/15312 ,  H01L2924/16152 ,  H05K3/301 ,  H05K3/303 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2203/167 ,  Y02P70/613

Abstract: An apparatus for providing mechanical support to a column grid array package is disclosed. The column grid array package uses solder columns to provide electrical connections between a ceramic substrate and a printed circuit board. The ceramic substrate has two sides, with an integrated circuit chip mounted on one side and many input/output pads mounted on the other side. Solder columns are attached between the input/output pads and the printed circuit board. A corner post is located at each corner of the column grid array package to secure the position of the ceramic substrate in relation to the printed circuit board.

Abstract translation: 公开了一种用于向列格栅阵列封装提供机械支撑的装置。 列栅阵列封装使用焊料柱来提供陶瓷基板和印刷电路板之间的电连接。 陶瓷基板具有两侧，其一侧安装有集成电路芯片，另一侧安装有许多输入/输出焊盘。 焊盘安装在输入/输出焊盘和印刷电路板之间。 角柱位于列栅格阵列封装的每个角上，以固定陶瓷基板相对于印刷电路板的位置。