METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE

    公开(公告)号:US20230238287A1

    公开(公告)日:2023-07-27

    申请号:US17584669

    申请日:2022-01-26

    CPC classification number: H01L22/12 H01L24/80 H01L2224/80895 H01L2224/80896

    Abstract: Methods and apparatus for processing a first substrate and a second substrate are provided herein. For example, a method of processing a substrate using extended spectroscopic ellipsometry (ESE) includes directing a beam from an extended spectroscopic ellipsometer toward a first surface of a first substrate and a second surface of a second substrate, which is different than the first substrate, determining in-situ ESE data from each of the first surface and the second surface during processing of the first substrate and the second substrate, measuring a change of phase and amplitude in determined in-situ ESE data, and determining one or more parameters of the first surface of the first substrate and the second surface of the second substrate using simultaneously complex dielectric function, optical conductivity, and electronic correlations from the measured change of phase and amplitude in the in-situ ESE data.

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