公开(公告)号：US20190229004A1

公开(公告)日：2019-07-25

申请号：US16357101

申请日：2019-03-18

Applicant: Applied Materials, Inc.

Inventor： Jason M. SCHALLER ,  Michael ROHRER ,  Tuan Anh NGUYEN ,  William Tyler WEAVER ,  Gregory John FREEMAN ,  Robert Brent VOPAT

IPC: H01L21/68 ,  C23C16/52 ,  H01L21/687 ,  H01L21/02 ,  C23C16/458 ,  G05B19/418 ,  C23C16/455

Abstract: A method and apparatus for of improving processing results in a processing chamber by orienting a substrate support relative to a surface within the processing chamber. The method comprising orienting a supporting surface of a substrate support in a first orientation relative to an output surface of a showerhead, where the first orientation of the supporting surface relative to the output surface is not coplanar, and depositing a first layer of material on a substrate disposed on the supporting surface that is oriented in the first orientation

公开(公告)号：US20190295872A1

公开(公告)日：2019-09-26

申请号：US16431239

申请日：2019-06-04

Applicant: Applied Materials, Inc.

Inventor： Shay ASSAF ,  Andrew CONSTANT ,  Jacob NEWMAN ,  Charles CARLSON ,  William Tyler WEAVER ,  Stephen HICKERSON

IPC: H01L21/67

Abstract: Methods and apparatus for processing a substrate are provided herein. In one implementation, the apparatus includes a load lock chamber coupled to a transfer chamber. The transfer chamber is coupled to a thermal process chamber and a substrate is transferred between each of the load lock chamber, the transfer chamber, and the thermal process chamber. In other implementations, a process platform having a load lock chamber, a transfer chamber, and a thermal process chamber is disclosed. Methods of measuring oxygen concentration in a load lock chamber via evacuation of a transfer chamber are also described herein.

公开(公告)号：US20180254207A1

公开(公告)日：2018-09-06

申请号：US15660784

申请日：2017-07-26

Applicant: Applied Materials, Inc.

Inventor： Shay ASSAF ,  Andrew CONSTANT ,  Jacob NEWMAN ,  Charles CARLSON ,  William Tyler WEAVER ,  Stephen HICKERSON

IPC: H01L21/67

CPC classification number: H01L21/67196 ,  H01L21/67109 ,  H01L21/67161 ,  H01L21/67184 ,  H01L21/67201 ,  H01L21/67207

Abstract: Methods and apparatus for processing a substrate are provided herein. In one implementation, the apparatus includes a load lock chamber coupled to a transfer chamber. The transfer chamber is coupled to a thermal process chamber and a substrate is transferred between each of the load lock chamber, the transfer chamber, and the thermal process chamber. In other implementations, a process platform having a load lock chamber, a transfer chamber, and a thermal process chamber is disclosed. Methods of measuring oxygen concentration in a load lock chamber via evacuation of a transfer chamber are also described herein.

公开(公告)号：US20180096874A1

公开(公告)日：2018-04-05

申请号：US15705031

申请日：2017-09-14

Applicant: Applied Materials, Inc.

Inventor： Jason M. SCHALLER ,  Michael Paul ROHRER ,  Tuan Anh NGUYEN ,  William Tyler WEAVER ,  Gregory John FREEMAN ,  Robert Brent VOPAT

IPC: H01L21/68 ,  H01L21/02 ,  H01L21/687 ,  C23C16/458 ,  C23C16/455 ,  C23C16/52 ,  G05B19/418

CPC classification number: H01L21/68 ,  C23C16/45565 ,  C23C16/458 ,  C23C16/4584 ,  C23C16/52 ,  G05B19/418 ,  G05B2219/45031 ,  H01L21/022 ,  H01L21/02271 ,  H01L21/68785

Abstract: A method and apparatus for of improving processing results in a processing chamber by orienting a substrate support relative to a surface within the processing chamber. The method comprising orienting a supporting surface of a substrate support in a first orientation relative to an output surface of a showerhead, where the first orientation of the supporting surface relative to the output surface is not coplanar, and depositing a first layer of material on a substrate disposed on the supporting surface that is oriented in the first orientation

公开(公告)号：US20220130700A1

公开(公告)日：2022-04-28

申请号：US17647120

申请日：2022-01-05

Applicant: Applied Materials, Inc.

Inventor： Jacob NEWMAN ,  Ulrich OLDENDORF ,  Martin AENIS ,  Andrew J. CONSTANT ,  Shay ASSAF ,  Jeffrey C. HUDGENS ,  Alexander BERGER ,  William Tyler WEAVER

IPC: H01L21/677 ,  B65G47/92 ,  H01L21/67 ,  H01L21/687

Abstract: Embodiments herein relate to a transport system and a substrate processing and transfer (SPT) system. The SPT system includes a transport system that connects two processing tools. The transport system includes a vacuum tunnel that is configured to transport substrates between the processing tools. The vacuum tunnel includes a substrate transport carriage to move the substrate through the vacuum tunnel. The SPT system has a variety of configurations that allow the user to add or remove processing chambers, depending on the process chambers required for a desired substrate processing procedure.