公开(公告)号：US20190299537A1

公开(公告)日：2019-10-03

申请号：US16289213

申请日：2019-02-28

Applicant: Applied Materials, Inc.

Inventor： William H. MCCLINTOCK ,  Rajeev BAJAJ ,  Jason G. FUNG ,  Daniel REDFIELD

IPC: B29C64/393 ,  G06F9/30 ,  G01B9/02

Abstract: Embodiments disclosed herein provide methods of forming bond pad redistribution layers (RDLs) in a fan-out wafer level packaging (FOWLP) scheme using an additive manufacturing process. In one embodiment, a method of forming a redistribution layer includes positioning a carrier substrate on a manufacturing support of an additive manufacturing system, the carrier substrate including a plurality of singulated devices, detecting one or more fiducial features corresponding to each of the plurality of singulated devices, determining actual positions of each of the plurality of singulated devices relative to one or more components of the additive manufacturing system, generating printing instructions for forming a patterned dielectric layer based on the actual positions of each of the plurality of singulated devices, and forming the patterned dielectric layer using the printing instructions.