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公开(公告)号:US20170092511A1
公开(公告)日:2017-03-30
申请号:US15013547
申请日:2016-02-02
发明人: Saptarshi BASU , Jeongmin LEE , Paul CONNORS , Dale R. DU BOIS , Prashant Kumar KULSHRESHTHA , Karthik Thimmavajjula NARASIMHA , Brett BERENS , Kalyanjit GHOSH , Jianhua ZHOU , Ganesh BALASUBRAMANIAN , Kwangduk Douglas LEE , Juan Carlos ROCHA-ALVAREZ , Hiroyuki OGISO , Liliya KRIVULINA , Rick GILBERT , Mohsin WAQAR , Venkatanarayana SHANKARAMURTHY , Hari K. PONNEKANTI
IPC分类号: H01L21/67 , H01J37/32 , H01L21/687
CPC分类号: H01L21/67069 , H01J37/32009 , H01J37/32357 , H01J37/32366 , H01J37/3244 , H01J37/32633 , H01J37/32715 , H01J2237/334 , H01L21/6708 , H01L21/67201 , H01L21/68785
摘要: Implementations disclosed herein describe a bevel etch apparatus within a loadlock bevel etch chamber and methods of using the same. The bevel etch apparatus has a mask assembly within the loadlock bevel etch chamber. During an etch process, the mask assembly delivers a gas flow to control bevel etch without the use of a shadow frame. As such, the edge exclusion at the bevel edge can be reduced, thus increasing product yield.
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公开(公告)号:US20200234982A1
公开(公告)日:2020-07-23
申请号:US16838128
申请日:2020-04-02
发明人: Saptarshi BASU , Jeongmin LEE , Paul CONNORS , Dale R. DU BOIS , Prashant Kumar KULSHRESHTHA , Karthik Thimmavajjula NARASIMHA , Brett BERENS , Kalyanjit GHOSH , Jianhua ZHOU , Ganesh BALASUBRAMANIAN , Kwangduk Douglas LEE , Juan Carlos ROCHA-ALVAREZ , Hiroyuki OGISO , Liliya KRIVULINA , Rick GILBERT , Mohsin WAQAR , Venkatanarayana SHANKARAMURTHY , Hari K. PONNEKANTI
IPC分类号: H01L21/67 , H01J37/32 , H01L21/687
摘要: Implementations disclosed herein describe a bevel etch apparatus within a loadlock bevel etch chamber and methods of using the same. The bevel etch apparatus has a mask assembly within the loadlock bevel etch chamber. During an etch process, the mask assembly delivers a gas flow to control bevel etch without the use of a shadow frame. As such, the edge exclusion at the bevel edge can be reduced, thus increasing product yield.
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