公开(公告)号：US20220033958A1

公开(公告)日：2022-02-03

申请号：US16944511

申请日：2020-07-31

Applicant: Applied Materials, Inc.

Inventor： Thomas DEPPISCH ,  Stefan BANGERT ,  Annabelle HOFMANN ,  Andreas LOPP ,  Thomas GOIHL

IPC: C23C14/24 ,  C23C14/04 ,  C23C14/50

Abstract: An evaporation source for depositing an evaporated material on a substrate is described. The evaporation source includes an evaporation crucible for evaporating a material; a vapor distributor with a plurality of nozzles for directing the evaporated material toward the substrate; a vapor conduit extending in a conduit length direction (A) from the evaporation crucible to the vapor distributor and providing a fluid connection between the evaporation crucible and the vapor distributor, wherein at least one nozzle of the plurality of nozzles has a nozzle axis extending in, or essentially parallel to, the conduit length direction (A); and a baffle arrangement in the vapor conduit. Further described are a vapor deposition apparatus including such an evaporation source and methods of coating a substrate in a vacuum chamber.