EVAPORATION SOURCE, VAPOR DEPOSITION APPARATUS, AND METHOD FOR COATING A SUBSTRATE IN A VACUUM CHAMBER

    公开(公告)号:US20220033958A1

    公开(公告)日:2022-02-03

    申请号:US16944511

    申请日:2020-07-31

    Abstract: An evaporation source for depositing an evaporated material on a substrate is described. The evaporation source includes an evaporation crucible for evaporating a material; a vapor distributor with a plurality of nozzles for directing the evaporated material toward the substrate; a vapor conduit extending in a conduit length direction (A) from the evaporation crucible to the vapor distributor and providing a fluid connection between the evaporation crucible and the vapor distributor, wherein at least one nozzle of the plurality of nozzles has a nozzle axis extending in, or essentially parallel to, the conduit length direction (A); and a baffle arrangement in the vapor conduit. Further described are a vapor deposition apparatus including such an evaporation source and methods of coating a substrate in a vacuum chamber.

    FILM FORMING APPARATUS
    2.
    发明申请

    公开(公告)号:US20180363130A1

    公开(公告)日:2018-12-20

    申请号:US16062072

    申请日:2015-12-21

    Abstract: An apparatus for processing a thin film on a substrate is described. The apparatus includes a vacuum chamber comprising a housing, a rear wall and a removable closing plate; a processing drum being arranged between the rear wall and the removable closing plate inside the vacuum chamber, the processing drum being at least partially surrounded by a processing region; a first process separating wall portion attached to the removable closing plate; a second process separating wall portion attached to the housing or the rear wall; wherein in a closed position of the removable closing plate, the first process separating wall portion and the second process separating wall portion jointly provide a process separating wall dividing the processing region into adjacent processing sections.

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