公开(公告)号：US11967516B2

公开(公告)日：2024-04-23

申请号：US17423689

申请日：2020-01-17

Applicant: Applied Materials, Inc.

Inventor： Jrjyan Jerry Chen ,  Sanjay D. Yadav ,  Tae Kyung Won ,  Jun Li ,  Shouqian Shao ,  Surendra Kanimihally Setty

IPC: H01T23/00 ,  C23C16/04 ,  C23C16/458 ,  C23C16/50 ,  H01J37/32 ,  H01L21/683 ,  H01L21/687

CPC classification number: H01L21/6833 ,  C23C16/042 ,  C23C16/4586 ,  C23C16/50 ,  H01J37/32715 ,  H01L21/68757 ,  H01L21/68785 ,  H01J2237/2007 ,  H01J2237/3321

Abstract: Embodiments of the disclosure include methods and apparatus for electrostatically coupling a mask to a substrate support in a deposition chamber. In one embodiment, a substrate support is disclosed that includes a substrate receiving surface, a recessed portion disposed about a periphery of the substrate receiving surface, an electrostatic chuck disposed below the substrate receiving surface, and a plurality of compressible buttons disposed within a respective opening formed in the recessed portion that form an electrical circuit with the electrostatic chuck.