公开(公告)号：US11670532B1

公开(公告)日：2023-06-06

申请号：US17543150

申请日：2021-12-06

Applicant: Applied Materials, Inc.

Inventor： Scott E. Peitzsch ,  Robert Mitchell

IPC: H01L31/00 ,  H01L21/683 ,  H01J37/20 ,  H01J37/317

CPC classification number: H01L21/6833 ,  H01J37/20 ,  H01J37/3171 ,  H01J2237/002 ,  H01J2237/0473 ,  H01J2237/2007 ,  H01J2237/20214

Abstract: A system and method for controlling electrostatic clamping of multiple platens on a spinning disk is disclosed. The system comprises a semiconductor processing system, such as a high energy implantation system. The semiconductor processing system produces a spot ion beam, which is directed to a plurality of workpieces, which are disposed on a spinning disk. The spinning disk comprises a rotating central hub with a plurality of platens. The plurality of platens may extend outward from the central hub and workpieces are electrostatically clamped to the platens. The central hub provides the electrostatic clamping voltages to each of the plurality of platens. Further, the plurality of platens may also be capable of rotation about an axis orthogonal to the rotation axis of the central hub. The central hub controls the rotation of each of the platens. Power connections and communications are provided to the central hub via the spindle assembly.

公开(公告)号：US20210005421A1

公开(公告)日：2021-01-07

申请号：US16459970

申请日：2019-07-02

Applicant: APPLIED Materials, Inc.

Inventor： Scott E. Peitzsch

IPC: H01J37/30 ,  H01J37/05 ,  H01J37/12 ,  H01J37/147

Abstract: Provided herein are approaches for reducing particles in an ion implanter. In some embodiments, an electrostatic filter of the ion implanter may include a housing and a plurality of conductive beam optics within the housing, the plurality of conductive beam optics arranged around an ion beam-line. At least one conductive beam optic of the plurality of conductive beam optics may include a conductive core element, a resistive material disposed around the conductive core, and a conductive layer disposed around the resistive material.

公开(公告)号：US20230178405A1

公开(公告)日：2023-06-08

申请号：US17543150

申请日：2021-12-06

Applicant: Applied Materials, Inc.

Inventor： Scott E. Peitzsch ,  Robert Mitchell

IPC: H01L21/683 ,  H01J37/20 ,  H01J37/317

CPC classification number: H01L21/6833 ,  H01J37/20 ,  H01J37/3171 ,  H01J2237/2007 ,  H01J2237/20214 ,  H01J2237/0473 ,  H01J2237/002

Abstract: A system and method for controlling electrostatic clamping of multiple platens on a spinning disk is disclosed. The system comprises a semiconductor processing system, such as a high energy implantation system. The semiconductor processing system produces a spot ion beam, which is directed to a plurality of workpieces, which are disposed on a spinning disk. The spinning disk comprises a rotating central hub with a plurality of platens. The plurality of platens may extend outward from the central hub and workpieces are electrostatically clamped to the platens. The central hub provides the electrostatic clamping voltages to each of the plurality of platens. Further, the plurality of platens may also be capable of rotation about an axis orthogonal to the rotation axis of the central hub. The central hub controls the rotation of each of the platens. Power connections and communications are provided to the central hub via the spindle assembly.