公开(公告)号：US20220093426A1

公开(公告)日：2022-03-24

申请号：US17026862

申请日：2020-09-21

Applicant: Applied Materials, Inc.

Inventor： Samuel W. Shannon ,  Luke Bonecutter ,  Viren Kalsekar ,  Chahal Neema

IPC: H01L21/67 ,  H01J37/32

Abstract: Exemplary substrate processing systems may include a base. The systems may include a chamber body having a transfer region housing that defines a transfer region. The transfer region housing may include a first portion and a second portion. The systems may include a lid assembly positioned atop the chamber body. The lid assembly may include a lid and a lid stack. The systems may include one or more lift mechanisms that elevate the first portion of the transfer region housing and at least a portion of the lid assembly relative to the base. The first portion and the second portion may mate with one another when the transfer region housing is in an operational configuration. The first portion and the second portion may be separated when the first portion of the transfer region housing is elevated.