公开(公告)号：US20170307310A1

公开(公告)日：2017-10-26

申请号：US15472691

申请日：2017-03-29

Applicant: Applied Materials, Inc.

Inventor： Jianqi WANG ,  Joung Woo LEE ,  Gia PHAM ,  Alex GERRARD ,  Robert C. MCINTOSH

IPC: F28F19/00 ,  H01L21/67 ,  F28F23/00

CPC classification number: F28F19/00 ,  C09K5/10 ,  F28F23/00 ,  H01L21/67098 ,  H01L21/67109 ,  H01L21/67253

Abstract: Implementations described herein generally relate to substrate processing equipment and more particularly to methods and compositions for temperature control of substrate processing equipment. In one implementation, a method of cooling a processing chamber component is provided. The method comprises introducing an inert purge gas into a supply reservoir containing a coolant and flowing the treated coolant to a processing chamber component to cool the processing chamber component. The coolant initially comprises deionized water and a water-soluble base.