公开(公告)号：US20030029726A1

公开(公告)日：2003-02-13

申请号：US09924080

申请日：2001-08-07

申请人： Applied Materials, Inc.

发明人： Nicolay Kovarsky ,  Zhi-Wen Sun ,  Girish A. Dixit

IPC分类号： C25D021/12 ,  C25D005/00 ,  C25D017/00

CPC分类号： C25D21/12

摘要： The present invention generally relates to an apparatus and method of evaluating electroplating solutions and conditions. In one embodiment, the method of evaluating electroplating solutions comprises utilizing an electrochemical measuring cell having a working electrode having a lid with at least one hole, a counter electrode, and a reference electrode. The working electrode, the counter electrode, and the reference electrode are immersed in at least one sample of at least one electroplating solution. The lid is disposed over the working electrode forming a chamber between the working electrode and the lid. The lid further has a hole to allow an electroplating solution to flow into the chamber and reach the working electrode. The potential of the working electrode in the sample of the electroplating solution is measured over time with a constant current supplied to the working electrode. The electrochemical measurements may be used to determine which solutions are capable of bottom-up filling and may be used to estimate the optimal electroplating parameters. In still another embodiment, the present invention relates to an apparatus for electroplating a substrate comprises a chamber body, an anode disposed in the chamber body, a contact ring disposed in the chamber body, one or more power supplies coupled to the anode and the contact ring, and an electrochemical measuring cell disposed in the chamber body or coupled to an electrolyte output coupled to the chamber body.

摘要翻译： 本发明一般涉及一种评估电镀溶液和条件的设备和方法。 在一个实施例中，电镀溶液的评估方法包括利用电化学测量单元，该电化学测量单元具有具有至少一个孔的盖的工作电极，对电极和参比电极。 工作电极，对电极和参比电极浸入至少一个电镀溶液的至少一个样品中。 盖子设置在工作电极之上，在工作电极和盖子之间形成一个室。 盖子还具有孔，以允许电镀溶液流入室并到达工作电极。 在供给工作电极的恒定电流下，随时间测量电镀液样品中的工作电极的电位。 电化学测量可用于确定哪些溶液能够自下而上填充，并可用于估计最佳电镀参数。 在另一个实施例中，本发明涉及一种用于电镀基板的设备，包括室主体，设置在室主体中的阳极，设置在室主体中的接触环，耦合到阳极和接触件的一个或多个电源 环和电化学测量单元，其设置在室主体中或耦合到耦合到室主体的电解质输出。

公开(公告)号：US20040154915A1

公开(公告)日：2004-08-12

申请号：US10360234

申请日：2003-02-06

申请人： Applied Materials, Inc.

发明人： Nicolay Kovarsky ,  Michael Yang ,  Dmitry Lubomirsky

IPC分类号： C25B015/00

CPC分类号： H01L21/2885 ,  C25D17/001

摘要： Embodiments of the invention generally provide a substrate processing system and method. The substrate processing system generally includes a fluid basin configured to contain a plating solution therein, an anode assembly positioned in a lower portion of the fluid basin, a separation membrane positioned across the fluid basin above the anode assembly, a diffusion member positioned across the fluid basin above the separation membrane, and a plating membrane positioned across the fluid basin above the diffusion member. The plating method generally includes immersing the substrate in a plating solution, the plating solution containing metal ions to be plated, contacting a plating surface of the semiconductor substrate with a plating membrane, applying a plating bias to the semiconductor substrate to plate the metal ions in the plating solution positioned adjacent the plating surface of the substrate, removing the plating surface from contact with the plating membrane for a predetermined period of time, and recontacting the plating surface with the plating membrane to continue plating the metal ions onto the plating surface.

摘要翻译： 本发明的实施例通常提供一种基板处理系统和方法。 衬底处理系统通常包括配置成在其中容纳电镀液的流体池，位于流体池的下部的阳极组件，位于阳极组件上方的横跨流体池的隔离膜，跨过流体定位的扩散构件 在分离膜之上的盆地，以及位于扩散构件上方的横跨流体池的镀膜。 电镀方法通常包括将衬底浸入电镀溶液中，镀敷溶液含有待镀覆的金属离子，与半导体衬底的电镀表面接触镀覆膜，向半导体衬底施加电镀偏压以将金属离子 所述电镀液位于所述基板的电镀面附近，除去所述电镀表面与所述镀膜接触预定的时间，并且将所述电镀表面与所述电镀膜重新接触以继续将所述金属离子电镀到所述电镀表面上。

公开(公告)号：US20030201191A1

公开(公告)日：2003-10-30

申请号：US10135485

申请日：2002-04-29

申请人： Applied Materials, Inc.

发明人： Nicolay Kovarsky ,  Zhi-Wen Sun

IPC分类号： G01N027/48

CPC分类号： G01N27/48 ,  C25D3/38 ,  C25D21/12

摘要： A voltammetric method for measuring the concentration of additives in a plating solution. The method generally includes providing the plating solution, including an unknown concentration of an additive to be measured, cycling an inert working electrode potential to alternately deposit and strip metal from the working electrode surface in the plating solution, wherein the metal deposition step includes a constant voltage plateau at a plateau potential sufficient to eliminate the interference of additives in the plating solution other than the additive to be measured. The method further includes determining a profile of the anodic current resulting from the applied working electrode potential as a function of time and determining a stripping peak area. The method may further include determining the concentration of the additive to be measured by the ratio of the stripping peak area from the profile to a stripping peak area of a base solution not including the additive to be measured.

摘要翻译： 用于测量电镀溶液中添加剂浓度的伏安法。 该方法通常包括提供包括未测浓度的待测量添加剂的电镀溶液，循环惰性工作电极电位以在电镀溶液中从工作电极表面交替沉积和剥离金属，其中金属沉积步骤包括常数 具有足以消除除了待测量的添加剂之外的电镀溶液中的添加剂的干扰的平台电压。 该方法还包括确定由施加的工作电极电位产生的阳极电流的轮廓作为时间的函数并确定剥离峰面积。 该方法还可以包括通过不包括待测量的添加剂的碱溶液的剥离峰面积与轮廓的剥离峰面积的比率确定待测量的添加剂的浓度。

公开(公告)号：US20040016636A1

公开(公告)日：2004-01-29

申请号：US10268284

申请日：2002-10-09

申请人： Applied Materials, Inc.

发明人： Michael X. Yang ,  Dmitry Lubomirsky ,  Yezdi Dordi ,  Saravjeet Singh ,  Sheshraj Tulshibagwale ,  Nicolay Kovarsky

IPC分类号： C25B013/02

CPC分类号： H01L21/2885 ,  A23D7/00 ,  A23D7/005 ,  A23D7/01 ,  A23J7/00 ,  C07F9/103 ,  C25D7/123 ,  C25D17/001

摘要： Embodiments of the invention may generally provide a small volume electrochemical plating cell. The plating cell generally includes a fluid basin configured to contain a plating solution therein, the fluid basin having a substantially horizontal weir. The cell further includes an anode positioned in a lower portion of the fluid basin, the anode having a plurality of parallel channels formed therethrough, and a base member configured to receive the anode, the base member having a plurality of groves formed into an anode receiving surface, each of the plurality of grooves terminating into an annular drain channel. A membrane support assembly configured to position a membrane immediately above the anode in a substantially planar orientation with respect to the anode surface is provided, the membrane support assembly having a plurality of channels and bores formed therein.

摘要翻译： 本发明的实施方案通常可以提供小体积的电化学电镀单元。 电镀槽通常包括配置成在其中容纳电镀液的流体池，流体池具有基本上水平的堰。 电池还包括位于流体槽的下部的阳极，阳极具有穿过其形成的多个平行通道，以及构造成容纳阳极的基座构件，底座构件具有形成为阳极接收的多个槽 多个槽中的每一个终止于环形排水通道。 提供了一种膜支撑组件，其被配置为将膜垂直于阳极定位在相对于阳极表面的基本上平面的方向上，膜支撑组件具有形成在其中的多个通道和孔。

公开(公告)号：US20030209440A1

公开(公告)日：2003-11-13

申请号：US10142719

申请日：2002-05-08

申请人： Applied Materials, Inc.

发明人： Zhi-Wen Sun ,  Nicolay Kovarsky ,  Chunman Yu ,  Girish Dixit

IPC分类号： C25D021/12

CPC分类号： C25D21/12

摘要： A cyclic voltammetric method for measuring the concentration of additives in a plating solution. The method generally includes providing the plating solution, having an unknown concentration of an additive to be measured therein and cycling the potential of an inert working electrode through a series of measurement steps. The series of measurement steps includes a metal stripping step including pulsing from an open circuit potential to a metal stripping potential between about 0.2 V and about 0.8 V, and holding the metal stripping potential until a corresponding current nears 0 mA/cm. The series of measurement steps further includes a cleaning step including pulsing from the metal stripping potential to a cleaning potential between about 1.2 V and about 1.6 V, and holding the cleaning potential for about 2 seconds to about 10 seconds. The series of measurement steps then includes a pre-plating step including pulsing from the cleaning potential to a pre-plating potential between about null0.2 V and about null0.5 V, and holding the pre-plating potential for about 2 seconds to about 10 seconds. The series of measurement steps additionally includes an equilibration step including pulsing from the pre-plating potential to the open circuit potential, and holding the open circuit potential for a predetermined time period, and a metal deposition step including scanning from the open circuit potential of the equilibration step to an additive sensitive potential, holding the additive sensitive potential for about 1 second to about 30 seconds, and scanning back to the open circuit potential. The method further includes plotting a profile of a deposition current resulting from the metal deposition potential as a function of time and integrating the deposition current to determine the concentration of the additive to be measured.

摘要翻译： 一种用于测量电镀溶液中添加剂浓度的循环伏安法。 该方法通常包括提供具有未测量的待测量添加剂浓度的电镀溶液，并通过一系列测量步骤循环惰性工作电极的电位。 一系列测量步骤包括金属剥离步骤，包括从约0.2V至约0.8V之间的开路电位脉冲至金属剥离电势，并保持金属剥离电位，直到相应的电流接近0mA / cm。 一系列测量步骤还包括清洁步骤，其包括从金属剥离电位脉冲至约1.2V至约1.6V之间的清洁电势，并将清洁电位保持约2秒至约10秒。 所述一系列测量步骤包括预镀步骤，包括从清洁电势脉冲至约-0.2V至约-0.5V之间的预镀电势，并将预镀电位保持约2秒至约10秒 。 一系列测量步骤还包括平衡步骤，包括从预镀电位脉冲到开路电位，并将开路电位保持预定时间段，以及金属沉积步骤，包括从开路电位扫描 平衡步骤到加性敏感电位，保持添加剂敏感电位约1秒至约30秒，并扫描回开路电位。 该方法还包括绘制由金属沉积电势产生的沉积电流的轮廓作为时间的函数，并且积分沉积电流以确定待测量的添加剂的浓度。

公开(公告)号：US20040065543A1

公开(公告)日：2004-04-08

申请号：US10263563

申请日：2002-10-02

申请人： Applied Materials, Inc.

发明人： Nicolay Kovarsky

IPC分类号： C25D017/00

CPC分类号： C25D7/12 ,  H01L21/2885

摘要： An apparatus and method for plating a metal onto a substrate. The apparatus generally includes an anode electrode disposed in the electrochemical cell and a cathode electrode disposed opposite the anode electrode in the electrochemical cell. The apparatus further includes an electrode lid having more than one aperture disposed between the anode electrode and the cathode electrode, the apertures configured to electrically connect the cathode electrode and the anode electrode. The method generally includes supplying an electrolyte to a plating cell having an anode electrode, a cathode electrode disposed opposite the anode electrode and an electrode lid having more than one aperture positioned between the anode electrode and the cathode electrode, wherein supplying the electrolyte includes passing the electrolyte through the more than one aperture at a rate sufficient to prevent the upward migration of dissolved gas and applying an electrical bias to the plating cell to plat a metal from the electrolyte onto the substrate.

摘要翻译： 一种用于将金属电镀到基底上的装置和方法。 该装置通常包括设置在电化学电池中的阳极电极和在电化学电池中与阳极电极相对设置的阴极电极。 该装置还包括具有设置在阳极电极和阴极电极之间的多于一个孔的电极盖，所述孔构造成电连接阴极电极和阳极电极。 该方法通常包括向具有阳极电极，与阳极电极相对设置的阴极电极和位于阳极电极和阴极电极之间的多于一个孔的电极盖提供电解质，其中供应电解质包括通过 电解液以足以防止溶解气体向上迁移并向电镀细胞施加电偏压以将金属从电解质平板化到衬底上的速率通过多于一个孔径。

公开(公告)号：US20040000491A1

公开(公告)日：2004-01-01

申请号：US10187027

申请日：2002-06-28

申请人： Applied Materials, Inc.

发明人： Nicolay Kovarsky ,  Zhi-Wen Sun

IPC分类号： C25C007/00 ,  C25D017/00

CPC分类号： C25D21/14 ,  C25D7/12 ,  C25D21/18

摘要： The present invention generally provides an apparatus and method for neutralizing an acid in a plating solution. The apparatus generally includes a plating cell having an anolyte compartment containing an anolyte and a catolyte compartment containing a catolyte, wherein the anolyte compartment has an anolyte inlet and an anolyte drain and the catolyte compartment has a catolyte inlet and a catolyte drain, and a cell membrane disposed in the cell between the anolyte compartment and the catolyte compartment, wherein the membrane is selective to hydrogen ions and copper ions. The apparatus further includes a catolyte storage unit in fluid communication with the catolyte inlet and an electrochemical device in fluid communication with the catolyte chamber, the electrochemical device being configured to receive a portion of aged catolyte solution and correct a catolyte concentration. The method generally includes supplying an electrolyte solution to a copper plating cell, plating copper onto a substrate in the plating cell with the electrolyte solution, removing aged electrolyte solution from the plating cell, and neutralizing a portion of the used electrolyte solution with an electrochemical device.

摘要翻译： 本发明通常提供一种中和电镀液中的酸的装置和方法。 该设备通常包括具有阳极电解液室的电镀池，该阳极电解液室含有阳极电解液和含有聚集体的聚合物层，其中阳极电解液室具有阳极电解液入口和阳极电解液排出物，并且所述聚合物区域具有聚集体入口和聚集体排水口， 膜设置在阳极电解液室和聚合物室之间的电池中，其中膜对氢离子和铜离子是选择性的。 所述设备还包括与所述聚合物入口流体连通的聚合物储存单元和与所述聚集液室流体连通的电化学装置，所述电化学装置构造成接收一部分老化的聚集体溶液并校正聚集体浓度。 该方法通常包括向镀铜电池提供电解质溶液，用电解液将铜镀在电镀液中的基底上，从镀覆电池中除去老化的电解质溶液，并用电化学装置中和一部分使用的电解液 。

公开(公告)号：US20030150736A1

公开(公告)日：2003-08-14

申请号：US10074569

申请日：2002-02-11

申请人： Applied Materials, Inc.

发明人： Nicolay Kovarsky

IPC分类号： C25D003/38 ,  B01D061/44 ,  B01D061/52

CPC分类号： C25D21/18 ,  B01D61/44 ,  B01D61/52 ,  Y10S204/13

摘要： The present invention generally provides an apparatus and method for removing contaminants from a plating solution. The apparatus generally includes a plating cell having an electrolyte inlet and an electrolyte drain, an electrolyte storage unit in fluid communication with the electrolyte inlet, and an electrodialysis chamber in fluid communication with the electrolyte drain, wherein the electrodialysis chamber is generally configured to receive a portion of used electrolyte solution and remove contaminants therefrom. The method generally includes supplying an electrolyte solution to a copper plating cell, plating copper onto a substrate in the plating cell with the electrolyte solution, removing used electrolyte solution from the plating cell, and refreshing a portion of the used electrolyte solution with an electrodialysis cell.

摘要翻译： 本发明通常提供一种从电镀液中除去污染物的装置和方法。 该设备通常包括具有电解质入口和电解液排泄物的电镀池，与电解质入口流体连通的电解质储存单元以及与电解液排出流体连通的电渗析室，其中电渗析室通常构造成接收 使用的电解质溶液的一部分并从其中除去污染物。 该方法通常包括向镀铜电池提供电解质溶液，用电解液将铜镀在电镀液中的基底上，从电镀槽中除去使用的电解质溶液，并用电渗析池刷新一部分使用的电解液 。

公开(公告)号：US20030132118A1

公开(公告)日：2003-07-17

申请号：US10047537

申请日：2002-01-14

申请人： Applied Materials, Inc.

发明人： Nicolay Kovarsky

IPC分类号： C25D005/08 ,  C25D017/06

CPC分类号： C25D7/12 ,  C25D17/001

摘要： An electro-chemical deposition apparatus and method are generally provided. In one embodiment of the invention, an electro-chemical deposition apparatus includes a housing having a substrate support disposed therein and adapted to rotate a substrate. One or more electrical contact elements are disposed on the substrate support. A drive system is disposed proximate the housing. The drive system is magnetically coupled to and adapted to rotate the substrate support. In another embodiment, a method of plating a substrate includes the steps of covering a substrate supported within a housing with electrolyte, and displacing a portion of the electrolyte from the housing prior to electrically biasing the substrate, and electrically biasing the substrate.

摘要翻译： 通常提供电化学沉积装置和方法。 在本发明的一个实施例中，电化学沉积设备包括壳体，其具有设置在其中的衬底支撑件并且适于旋转衬底。 一个或多个电接触元件设置在基板支撑件上。 驱动系统设置在壳体附近。 驱动系统磁耦合到并适于旋转衬底支撑件。 在另一个实施例中，电镀衬底的方法包括以下步骤：用电解质覆盖支撑在壳体内的衬底，并且在电偏置衬底之前将电解质的一部分从壳体移位，并使衬底电偏置。