公开(公告)号：US20200066563A1

公开(公告)日：2020-02-27

申请号：US16673107

申请日：2019-11-04

Applicant: Applied Materials, Inc.

Inventor： Jared Ahmad LEE ,  Martin Jeff SALINAS ,  Paul B. REUTER ,  Imad YOUSIF ,  Aniruddha PAL

IPC: H01L21/677 ,  C23C16/455 ,  C23C16/458 ,  H01L21/687 ,  H01L21/67 ,  H01L21/306

Abstract: Embodiments of the present invention provide an apparatus for transferring substrates and confining a processing environment in a chamber. One embodiment of the present invention provides a hoop assembly for using a processing chamber. The hoop assembly includes a confinement ring defining a confinement region therein, and three or more lifting fingers attached to the hoop. The three or more lifting fingers are configured to support a substrate outside the inner volume of the confinement ring.

公开(公告)号：US20180247850A1

公开(公告)日：2018-08-30

申请号：US15963758

申请日：2018-04-26

Applicant: Applied Materials, Inc.

Inventor： Jared Ahmad LEE ,  Martin Jeff SALINAS ,  Paul B. REUTER ,  Imad YOUSIF ,  Aniruddha PAL

IPC: H01L21/677 ,  H01L21/687 ,  H01L21/306 ,  C23C16/455 ,  C23C16/458

CPC classification number: H01L21/67742 ,  C23C16/45517 ,  C23C16/4586 ,  H01L21/306 ,  H01L21/6719 ,  H01L21/67739 ,  H01L21/67751 ,  H01L21/68735 ,  H01L21/68742

Abstract: Embodiments of the present invention provide an apparatus for transferring substrates and confining a processing environment in a chamber. One embodiment of the present invention provides a hoop assembly for using a processing chamber. The hoop assembly includes a confinement ring defining a confinement region therein, and three or more lifting fingers attached to the hoop. The three or more lifting fingers are configured to support a substrate outside the inner volume of the confinement ring.

公开(公告)号：US20170040192A1

公开(公告)日：2017-02-09

申请号：US15222689

申请日：2016-07-28

Applicant: Applied Materials, Inc.

Inventor： Imad YOUSIF ,  Martin Jeffrey SALINAS ,  Paul B. REUTER ,  Aniruddha PAL ,  Jared Ahmad LEE

IPC: H01L21/67 ,  H01L21/683 ,  H01L21/324

CPC classification number: H01L21/67103 ,  H01L21/263 ,  H01L21/324 ,  H01L21/67109 ,  H01L21/67248 ,  H01L21/6838 ,  H01L21/68792 ,  H05B3/00

Abstract: Embodiments of the present invention provide an apparatus heating and supporting a substrate in a processing chamber. One embodiment of the present invention provides a substrate support assembly. The substrate support assembly includes a heated plate having a substrate supporting surface on a front side and a cantilever arm extending from a backside of the heated plate. The heated plate is configured to support and heat a substrate on the substrate supporting surface. The cantilever arm has a first end attached to the heated plate near a central axis of the heated plate, and a second end extending radially outwards from the central axis.

Abstract translation: 本发明的实施例提供一种在处理室中加热和支撑衬底的装置。 本发明的一个实施例提供一种基板支撑组件。 基板支撑组件包括加热板，其具有在前侧上的基板支撑表面和从加热板的后侧延伸的悬臂。 加热板被配置为支撑和加热基板支撑表面上的基板。 悬臂具有附接到加热板附近加热板的中心轴线的第一端和从中心轴径向向外延伸的第二端。

公开(公告)号：US20230162984A1

公开(公告)日：2023-05-25

申请号：US18096104

申请日：2023-01-12

Applicant: Applied Materials, Inc.

Inventor： Martin Jeffrey SALINAS ,  Paul B. REUTER ,  Andrew NGUYEN ,  Jared Ahmad LEE

IPC: H01L21/306 ,  H01L21/02 ,  H01L21/67

CPC classification number: H01L21/306 ,  H01L21/02063 ,  H01L21/67167 ,  H01L21/67201 ,  H01L21/02071

Abstract: Examples of the present invention include a method for removing halogen-containing residues from a substrate. The method includes transferring a substrate to a substrate processing system through a first chamber volume of a load lock chamber. The load lock chamber is coupled to a transfer chamber of the substrate processing system. The substrate is etched in one or more processing chambers coupled to the transfer chamber of the substrate processing system with chemistry from a showerhead disposed over a heated substrate support assembly. The chemistry includes halogen. Halogen-containing residues are removed from the etched substrate in a second chamber volume of the load lock chamber. Cooling the etched substrate in a cooled substrate support assembly of the load lock chamber after removing the halogen-containing residue.

公开(公告)号：US20200051825A1

公开(公告)日：2020-02-13

申请号：US16657586

申请日：2019-10-18

Applicant: Applied Materials, Inc.

Inventor： Martin Jeffrey SALINAS ,  Paul B. REUTER ,  Andrew NGUYEN ,  Jared Ahmad LEE

IPC: H01L21/306 ,  H01L21/02 ,  H01L21/67

Abstract: Examples of the present disclosure provide a load that includes a chamber body assembly. The chamber body assembly defines a first chamber volume and a second chamber volume fluidly isolated from one another. The first chamber volume and second chamber volume are selectively connectable to two environments through two sets of openings configured for substrate transferring. A third chamber volume is selectively connectable to the two environments through two sets of openings. A remote plasma source couples a processing gas source to the second chamber volume. A cooled substrate support assembly, includes a plurality of cooling channels, bounds a portion of the first chamber volume. A heated substrate support assembly can support a substrate. A gas distribution assembly, includes a showerhead, is disposed in the second chamber volume and is coupled to the remote plasma source. The showerhead can provide a processing gas to the second chamber volume.

公开(公告)号：US20200027742A1

公开(公告)日：2020-01-23

申请号：US16584732

申请日：2019-09-26

Applicant: Applied Materials, Inc.

Inventor： Jared Ahmad LEE ,  Martin Jeffrey SALINAS ,  Paul B. REUTER ,  Imad YOUSIF ,  Aniruddha PAL

IPC: H01L21/3065 ,  H01L21/3213 ,  H01L21/02 ,  H01J37/32 ,  H01L21/67

Abstract: Embodiments of the present invention provide a dual load lock chamber capable of processing a substrate. In one embodiment, the dual load lock chamber includes a chamber body defining a first chamber volume and a second chamber volume isolated from one another. Each of the lower and second chamber volumes is selectively connectable to two processing environments through two openings configured for substrate transferring. The dual load lock chamber also includes a heated substrate support assembly disposed in the second chamber volume. The heated substrate support assembly is configured to support and heat a substrate thereon. The dual load lock chamber also includes a remote plasma source connected to the second chamber volume for supplying a plasma to the second chamber volume.

公开(公告)号：US20140110057A1

公开(公告)日：2014-04-24

申请号：US14034482

申请日：2013-09-23

Applicant: APPLIED MATERIALS, INC.

Inventor： Jared Ahmad LEE ,  Paul B. REUTER

IPC: C23F1/08

CPC classification number: C23F1/08 ,  H01J37/32642

Abstract: Embodiments of the present invention include a focus ring segment and a focus ring assembly. In one embodiment, the focus ring segment includes an arc-shaped body having a lower ring segment, a middle ring segment, a top ring segment and a lip. The lower ring segment has a bottom surface, and the middle ring segment has a bottom surface, wherein the middle ring segment is connected to the lower ring segment at the middle ring segment bottom surface. The top ring segment has a bottom surface, wherein the top ring segment is connected to the middle ring segment at the top ring segment bottom surface. The lip extends horizontally above the middle ring segment, wherein the lip is sloped radially inwards towards a centerline of the focus ring segment. In another embodiment, the focus ring assembly includes at least a first ring segment and a second ring segment.

Abstract translation: 本发明的实施例包括聚焦环段和聚焦环组件。 在一个实施例中，聚焦环段包括具有下环段，中环段，顶环段和唇缘的弧形体。 下环段具有底面，中间环段具有底面，中间环段在中间环段底面处连接到下环段。 顶环段具有底表面，其中顶环段在顶部环段底表面处连接到中间环段。 唇缘在中间环段上方水平地延伸，其中唇部朝着聚焦环段的中心线径向向内倾斜。 在另一个实施例中，聚焦环组件至少包括第一环段和第二环段。