公开(公告)号：US20250143089A1

公开(公告)日：2025-05-01

申请号：US18690574

申请日：2023-12-13

Applicant: Applied Materials, Inc.

Inventor： Yu-Hsin LIN ,  Takashi ANJIKI ,  Chung-chia CHEN ,  Jae Wook JEONG ,  Ji Young CHOUNG ,  Jungmin LEE

IPC: H10K59/122 ,  H10K59/12 ,  H10K59/80 ,  H10K102/00

Abstract: Embodiments described herein relate to a device. The device includes a substrate, overhang structures disposed over the substrate, and a plurality of sub-pixels. Each overhang structure has a second structure disposed over a first structure. The second structure has an overhang extension extending laterally past the first structure. The first structure includes a first sidewall opposing a second sidewall. The first sidewall and the second sidewall are connected to each other. The plurality of sub-pixels each include an organic light-emitting diode (OLED) material, and a cathode disposed over the OLED material. The cathode extends under the overhang extension such that the cathode contacts the first sidewall and the second sidewall of the first structure under the overhang extension.