Resolution enhanced digital lithography with anti-blazed DMD

    公开(公告)号:US10983441B2

    公开(公告)日:2021-04-20

    申请号:US16532187

    申请日:2019-08-05

    IPC分类号: G03F7/20 G02B26/08

    摘要: Embodiments of the present disclosure generally relate to methods and apparatus for processing one or more substrates, and more specifically to improved spatial light modulators for digital lithography systems and digital lithography methods using improved spatial light modulators. The spatial light modulator is configured such that there is a 180-degree phase shift between adjacent spatial light modulator pixels. The spatial light modulator is useful for pixel blending by forming a plurality of partially overlapping images, at least one of the plurality of partially overlapping images having at least two pixels formed by a first pair of adjacent spatial light modulator pixels having a 180-degree phase shift therebetween. The spatial light modulator results in improved resolution, depth of focus, and pixel blending.

    Empirical detection of lens aberration for diffraction-limited optical system

    公开(公告)号:US10451564B2

    公开(公告)日:2019-10-22

    申请号:US15962981

    申请日:2018-04-25

    摘要: A method for qualitatively detecting aberration and determine aberration types in a photolithography system is disclosed. The method includes using a digital micromirror device (DMD) pattern to project an optical signal on a reflective substrate, acquiring a return optical signal reflected from the substrate at different focus heights (ranging from above to below best focus), forming a through focus curve based off of the return optical signal at various focus heights, comparing the through focus curve to a predetermined curve—the predetermined curve being a function of focus, and determining if a lens aberration is present. By using the existing hardware of the photolithography system to determine if a lens aberration exists, costs are maintained at a minimum and the DMD pattern creates a through focus curve (TFC) image in less than five minutes allowing for quick correction.

    Image improvement for alignment through incoherent illumination blending

    公开(公告)号:US10429744B2

    公开(公告)日:2019-10-01

    申请号:US16016162

    申请日:2018-06-22

    摘要: Methods and apparatuses are provided that determine an offset between actual feature/mark locations and the designed feature/mark locations in a maskless lithography system. For example, in one embodiment, a method is provided that includes opening a camera shutter in a maskless lithography system. Light is directed from a configuration of non-adjacent mirrors in a mirror array towards a first substrate layer. An image of the first substrate layer on a camera is captured and accumulated. Light is directed and images are captured repeatedly using different configurations of non-adjacent mirrors to cover an entire field-of-view (FOV) of the camera on the first substrate layer. Thereafter, the camera shutter is closed and the accumulated image is stored in memory.

    Piecewise alignment modeling method

    公开(公告)号:US10133193B2

    公开(公告)日:2018-11-20

    申请号:US15644284

    申请日:2017-07-07

    IPC分类号: G03F7/20

    摘要: Embodiments disclosed herein generally relate to adjusting exposure parameters of a substrate in response to an overlay error. The method includes partitioning the substrate into one or more sections. Each section corresponds to an image projection system. A total overlay error of a first layer deposited on the substrate is determined. For each section, a sectional overlay error is calculated. For each overlap area, in which two or more sections overlap, an average overlay error is calculated. The exposure parameters are adjusted in response to the total overlay error.

    System for making accurate grating patterns using multiple writing columns each making multiple scans

    公开(公告)号:US11243480B2

    公开(公告)日:2022-02-08

    申请号:US17057536

    申请日:2019-05-31

    IPC分类号: G03F7/20 G03F9/00 G02B5/18

    摘要: A lithography system for generating grating structures is provided having a multiple column imaging system located on a bridge capable of moving in a cross-scan direction, a mask having a grating pattern with a fixed spatial frequency located in an object plane of the imaging system, a multiple line alignment mark aligned to the grating pattern and having a fixed spatial frequency, a platen configured to hold and scan a substrate, a scanning system configured to move the platen over a distance greater than a desired length of the grating pattern on the substrate, a longitudinal encoder scale attached to the platen and oriented in a scan direction and at least two encoder scales attached to the platen and arrayed in the cross-scan direction wherein the scales contain periodically spaced alignment marks having a fixed spatial frequency.

    Resolution enhanced digital lithography with anti-blazed DMD

    公开(公告)号:US10372042B2

    公开(公告)日:2019-08-06

    申请号:US15871302

    申请日:2018-01-15

    IPC分类号: G03F7/20 G02B26/08

    摘要: Embodiments of the present disclosure generally relate to methods and apparatus for processing one or more substrates, and more specifically to improved spatial light modulators for digital lithography systems and digital lithography methods using improved spatial light modulators. The spatial light modulator is configured such that there is a 180-degree phase shift between adjacent spatial light modulator pixels. The spatial light modulator is useful for pixel blending by forming a plurality of partially overlapping images, at least one of the plurality of partially overlapping images having at least two pixels formed by a first pair of adjacent spatial light modulator pixels having a 180-degree phase shift therebetween. The spatial light modulator results in improved resolution, depth of focus, and pixel blending.