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公开(公告)号：US12111572B2
公开(公告)日：2024-10-08
申请号：US18333290
申请日：2023-06-12
Applicant: Applied Materials, Inc.
Inventor： Hao Tang , Kang Luo , Erica Chen , Yongan Xu
CPC classification number: G03F7/0005 , G02B5/1857 , G03F7/0002
Abstract: A method of imprinting a pattern on a substrate is provided. The method includes forming a first pattern on a plurality of masters using a method other than imprinting, the first pattern including a plurality of patterned features of varying sizes; measuring the patterned features at a plurality of locations on each of the masters; selecting a first master of the plurality of masters based on the measurements of the patterned features on each of the masters; using the first master to form a second pattern on an imprint template; and imprinting the first pattern on a first device with the imprint template.
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公开(公告)号：US11709423B2
公开(公告)日：2023-07-25
申请号：US17740116
申请日：2022-05-09
Applicant: Applied Materials, Inc.
Inventor： Hao Tang , Kang Luo , Erica Chen , Yongan Xu
CPC classification number: G03F7/0005 , G02B5/1857 , G03F7/0002
Abstract: A method of imprinting a pattern on a substrate is provided. The method includes forming a first pattern on a plurality of masters using a method other than imprinting, the first pattern including a plurality of patterned features of varying sizes; measuring the patterned features at a plurality of locations on each of the masters; selecting a first master of the plurality of masters based on the measurements of the patterned features on each of the masters; using the first master to form a second pattern on an imprint template; and imprinting the first pattern on a first device with the imprint template.
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公开(公告)号：US20220299677A1
公开(公告)日：2022-09-22
申请号：US17654860
申请日：2022-03-15
Applicant: Applied Materials, Inc.
Inventor： Erica CHEN , Kang Luo , Hao Tang , Jinrui Guo , Ludovic Godet
Abstract: Embodiments of the present disclosure generally relate to encapsulated optical devices and methods of forming encapsulated optical devices. The optical devices include a plurality of optical device structures disposed on a substrate. An encapsulation coating is disposed over the plurality of optical device structures. The encapsulation coating includes a ratio of encapsulation material to solvent. A plurality of gaps are formed in the optical device. The plurality of gaps are formed when the solvent is evaporated from the encapsulation coating. The material composition of the encapsulation coating, the width and device angle of the plurality of optical device structures, as well as process parameters of the spin on coating process, the curing process, the baking process, the drying process, and the developing process will affect the formation of the plurality of gaps and the depth at which the plurality of gaps are formed.
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