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公开(公告)号：US20250084528A1
公开(公告)日：2025-03-13
申请号：US18244197
申请日：2023-09-08
Applicant: Applied Materials, Inc.
Inventor： Arvinder ManmohanSingh Chadha
Abstract: A method includes: identifying property data associated with a substrate support system; identifying target performance data associated with the substrate support system; and causing, based on the property data and the target performance data, heat transfer management of the substrate support system.
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公开(公告)号：US20250084529A1
公开(公告)日：2025-03-13
申请号：US18244199
申请日：2023-09-08
Applicant: Applied Materials, Inc.
Inventor： Arvinder ManmohanSingh Chadha
Abstract: A method includes: identifying property data associated with a substrate support system; identifying target performance data associated with the substrate support system; determining, based on the property data and the target performance data, zone configuration data associated with the substrate support system; and causing the substrate support system to be configured based on the zone configuration data.
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公开(公告)号：US20250069864A1
公开(公告)日：2025-02-27
申请号：US18236201
申请日：2023-08-21
Applicant: Applied Materials, Inc.
Inventor： Arvinder ManmohanSingh Chadha , Syed Nazmul Ahsan , Glen T Mori
IPC: H01J37/32
Abstract: A substrate support assembly including a shaft and a susceptor disposed on the shaft. The susceptor is configured to support a substrate in a processing chamber during a substrate processing operation. The substrate support assembly comprises cooling features configured to cool the susceptor at a cooling rate of greater than 2 degrees Celsius per minute subsequent to the substrate processing operation.
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