Haptic actuator including thermally coupled heat spreading layer and related methods

    公开(公告)号:US10886821B2

    公开(公告)日:2021-01-05

    申请号:US16235091

    申请日:2018-12-28

    Applicant: Apple Inc.

    Abstract: A haptic actuator may include a housing that includes a ferromagnetic material having a first heat conductance, and a coil carried by the housing in a medial portion thereof and generating waste heat when electrically powered. The haptic actuator may also include a field member movable within the housing responsive to the coil. The field member may include at least one permanent magnet establishing a magnetic path with the housing. A heat spreading layer may be thermally coupled to the housing adjacent the coil. The heat spreading layer may have a second heat conductance greater than the first heat conductance to spread the waste heat from the coil to adjacent portions of the housing.

    HAPTIC ACTUATOR INCLUDING THERMALLY COUPLED HEAT SPREADING LAYER AND RELATED METHODS

    公开(公告)号:US20200212766A1

    公开(公告)日:2020-07-02

    申请号:US16235091

    申请日:2018-12-28

    Applicant: Apple Inc.

    Abstract: A haptic actuator may include a housing that includes a ferromagnetic material having a first heat conductance, and a coil carried by the housing in a medial portion thereof and generating waste heat when electrically powered. The haptic actuator may also include a field member movable within the housing responsive to the coil. The field member may include at least one permanent magnet establishing a magnetic path with the housing. A heat spreading layer may be thermally coupled to the housing adjacent the coil. The heat spreading layer may have a second heat conductance greater than the first heat conductance to spread the waste heat from the coil to adjacent portions of the housing.

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