公开(公告)号：US20150362791A1

公开(公告)日：2015-12-17

申请号：US14498814

申请日：2014-09-26

Applicant: Apple Inc.

Inventor： Tyler R. Kakuda ,  Shawn R. Gettemy ,  Mark T. Sullivan ,  Ihtesham H. Chowdhury

IPC: G02F1/1333 ,  G02F1/1335

CPC classification number: G02F1/133385 ,  F28F2013/006 ,  G02F1/133308 ,  G02F2001/133317 ,  G02F2001/133628 ,  H01L23/34 ,  H01L23/40 ,  H01L2023/4068

Abstract: An electronic device may have a housing in which components are mounted that produce heat. The heat producing components may be light-emitting diodes mounted on a flexible printed circuit in a display backlight, may be integrated circuits, or may be other devices that generate heat during operation. A heat spreading layer such as a layer of graphite may be attached to the backlight unit or other structures in the electronic device using adhesive. The adhesive may be patterned to form an unbonded area between at least some of the backlight unit or other structures to which the heat spreading layer is being attached and the heat spreading layer. The heat spreading layer may be mounted adjacent to a housing structure such as a metal midplate member that is attached to housing walls in the housing.

Abstract translation: 电子设备可以具有其中安装有产生热量的部件的壳体。 发热部件可以是安装在显示器背光源中的柔性印刷电路上的发光二极管，可以是集成电路，或者可以是在操作期间产生热量的其它装置。 可以使用粘合剂将诸如石墨层的散热层附着到电子设备中的背光单元或其它结构。 粘合剂可以被图案化以在至少一些背光单元或其它结构之间形成未结合的区域，散热层所附着的其它结构和散热层。 散热层可以安装在诸如附接到壳体中的壳体壁的金属中间板构件的壳体结构附近。

公开(公告)号：US09939672B2

公开(公告)日：2018-04-10

申请号：US14498814

申请日：2014-09-26

Applicant: Apple Inc.

Inventor： Tyler R. Kakuda ,  Shawn R. Gettemy ,  Mark T. Sullivan ,  Ihtesham H. Chowdhury

IPC: G02F1/1333 ,  G02F1/1335 ,  H01L23/34 ,  H01L23/40 ,  F28F13/00

CPC classification number: G02F1/133385 ,  F28F2013/006 ,  G02F1/133308 ,  G02F2001/133317 ,  G02F2001/133628 ,  H01L23/34 ,  H01L23/40 ,  H01L2023/4068

Abstract: An electronic device may have a housing in which components are mounted that produce heat. The heat producing components may be light-emitting diodes mounted on a flexible printed circuit in a display backlight, may be integrated circuits, or may be other devices that generate heat during operation. A heat spreading layer such as a layer of graphite may be attached to the backlight unit or other structures in the electronic device using adhesive. The adhesive may be patterned to form an unbonded area between at least some of the backlight unit or other structures to which the heat spreading layer is being attached and the heat spreading layer. The heat spreading layer may be mounted adjacent to a housing structure such as a metal midplate member that is attached to housing walls in the housing.