公开(公告)号：US11856720B2

公开(公告)日：2023-12-26

申请号：US17157938

申请日：2021-01-25

Applicant: Apple Inc.

Inventor： Nagarajan Kalyanasundaram ,  Richard Hung Minh Dinh ,  Amaury J. Heresztyn ,  Frank F. Liang ,  Stephen T. Schooley ,  Lian Zhang ,  Derek J. Dicarlo

IPC: H05K5/02 ,  G05B15/02 ,  H02J50/10 ,  H05K7/20 ,  G08C17/04

CPC classification number: H05K5/0217 ,  G05B15/02 ,  G08C17/04 ,  H02J50/10 ,  H05K7/20

Abstract: Electronic devices and accessory devices designed for communication with electronic devices are disclosed. An accessory device suitable for use with an electronic device can receive the electronic device. Subject to authentication, the electronic device can read information stored on the accessory device through respective wireless communication circuitry of the electronic device and the accessory device. For example, the accessory device can store information related to the material makeup of the accessory device, dimensional information of the accessory device, and other integrated features. This information can be read and received by the electronic device. As a result, the electronic device can adjust a control system (that regulates thermal energy generation) by increasing a set point temperature that allows one or more processors to operate in a manner consistent with additional thermal energy generation. However, the accessory device protects the user from exposure to the additional thermal energy, thereby preventing injury.

公开(公告)号：US09301429B2

公开(公告)日：2016-03-29

申请号：US13940171

申请日：2013-07-11

Applicant: Apple Inc.

Inventor： Lian Zhang ,  Amaury J. Heresztyn ,  Frank F. Liang

IPC: F21V29/00 ,  G06F3/041 ,  H05K7/20 ,  H05K5/00 ,  H01L23/373 ,  H04M1/02 ,  G02F1/1333

CPC classification number: H05K7/20436 ,  G02F1/13338 ,  G06F3/0412 ,  H01L23/373 ,  H01L2924/0002 ,  H04M1/0266 ,  H05K5/0017 ,  Y10T156/10 ,  H01L2924/00

Abstract: The described embodiments relate generally to thermal management and more particularly to a method and apparatus for providing thermal insulation from relatively small heat sources in small form factor electronic devices. An insulator layer can be placed between a small heat source and an exterior surface of the device, such as a cover glass layer. In one embodiment, a graphite layer can also be included between the cover glass layer and the insulator layer to spread any transmitted heat across the cover glass layer.

Abstract translation: 所描述的实施例总体上涉及热管理，更具体地涉及用于在小尺寸电子设备中从较小的热源提供热绝缘的方法和设备。 绝缘体层可以放置在小热源和装置的外表面之间，例如盖玻璃层。 在一个实施例中，也可以在覆盖玻璃层和绝缘体层之间包含石墨层，以将透射的热量散布穿过覆盖玻璃层。

公开(公告)号：US20140085911A1

公开(公告)日：2014-03-27

申请号：US13940171

申请日：2013-07-11

Applicant: Apple Inc.

Inventor： Lian Zhang ,  Amaury J. Heresztyn ,  Frank F. Liang

IPC: H05K7/20 ,  F21V29/00 ,  H05K5/00

CPC classification number: H05K7/20436 ,  G02F1/13338 ,  G06F3/0412 ,  H01L23/373 ,  H01L2924/0002 ,  H04M1/0266 ,  H05K5/0017 ,  Y10T156/10 ,  H01L2924/00

Abstract: The described embodiments relate generally to thermal management and more particularly to a method and apparatus for providing thermal insulation from relatively small heat sources in small form factor electronic devices. An insulator layer can be placed between a small heat source and an exterior surface of the device, such as a cover glass layer. In one embodiment, a graphite layer can also be included between the cover glass layer and the insulator layer to spread any transmitted heat across the cover glass layer.

Abstract translation: 所描述的实施例总体上涉及热管理，更具体地涉及用于在小尺寸电子设备中从较小的热源提供热绝缘的方法和设备。 绝缘体层可以放置在小热源和装置的外表面之间，例如盖玻璃层。 在一个实施例中，也可以在覆盖玻璃层和绝缘体层之间包含石墨层，以将透射的热量散布穿过覆盖玻璃层。