公开(公告)号：US10148447B1

公开(公告)日：2018-12-04

申请号：US15264194

申请日：2016-09-13

Applicant: Apple Inc.

Inventor： Abhilash Rajagopal ,  Kevin White ,  Leland W. Lew ,  Paul A. Baker

IPC: H04L12/10 ,  B60R16/03

Abstract: Aspects of the present disclosure involve a circuit for delivering electrical power from a direct current voltage source to an electronic system. The circuit may include a power injection circuit that injects a first portion of the power from a supply voltage of the source to a first data line and a second portion of the power from the supply voltage to a second data line. The power injection circuit may include first and second conductive paths from the supply voltage to the first and second data lines having first and second inductances, respectively, as well as a third conductive path between the first and second data lines having a third inductance greater than the first and second inductances. A conductive support structure may carry return current from the electronic system to the source.