Substrate to place components for camera size reduction

    公开(公告)号:US12126884B1

    公开(公告)日:2024-10-22

    申请号:US17664352

    申请日:2022-05-20

    Applicant: Apple Inc.

    CPC classification number: H04N23/54 H04N23/52

    Abstract: A camera may include a substrate for placing components. An image sensor having a light-receiving side and an opposite non-light-receiving side may be attached to a first side of the substrate to receive light from one or more lenses of the camera to capture an image. The camera may also include one or more additional components separate and distinct from the image sensor. The additional components may be placed beneath the non-light-receiving side of the image sensor. The components may be attached to a second side of the substrate opposite the first side where the image sensor is mounted at least partially inside one or more recesses, or embedded at least partially inside the substrate.

    Variable polyimide thickness to control pad impedance

    公开(公告)号:US11962881B1

    公开(公告)日:2024-04-16

    申请号:US17718210

    申请日:2022-04-11

    Applicant: Apple Inc.

    CPC classification number: H04N23/54 H04N23/665

    Abstract: Various embodiments include sensor shift flexure arrangements for improved signal routing. For example, a camera with sensor shift actuation may include a flexure for suspending an image sensor from a stationary structure of the camera, and for allowing motion of the image sensor enabled by one or more actuators of the camera. The flexure may be configured to convey electrical signals between the image sensor and a flex circuit in some embodiments. According to some embodiments, the flexure may include a stack of layers comprising a conductive layer and an electrical grounding. The conductive layer may include a signal pad region and a signal trace region. A distance between at least one section of the signal pad region and the electrical grounding may be greater than a distance between at least a section of the signal trace region and the electrical grounding.

    Camera module flexure with segmented base layer

    公开(公告)号:US12088897B1

    公开(公告)日:2024-09-10

    申请号:US17932619

    申请日:2022-09-15

    Applicant: Apple Inc.

    CPC classification number: H04N23/54 H04N23/52 H04N23/57 H04N23/687 G03B3/10

    Abstract: A flexure for a camera includes a dynamic platform to which an image sensor and a substrate are connected such that the image sensor and the substrate move together with the dynamic platform. A driver associated with an actuator to move the image sensor relative to a lens group is mounted to the substrate. The flexure also includes a static platform connected to a static portion of the camera, a plurality of flexure arms that mechanically connect the dynamic platform to the static platform, a routing layer and a base layer both at least partially forming the dynamic platform, the static platform, and the plurality of flexure arms, and at least one segmentation region extending through the base layer and configured to physically isolate a return current from the driver and through the base layer from a return current from the image sensor and through the base layer.

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