Abstract:
A durable, accessory cover assembly for a computing device, such as a cellular phone or a tablet computer. The accessory cover includes a frame, a first covering portion, and a second covering portion. The first covering can be composed of a wear-resistant material, such as leather; whereas, the second covering can be composed of a pliable particulate-absorbing material, such as microfiber. The first covering can be configured to seamlessly cover an external bottom surface of the frame, four external lateral surfaces of the frame, and four internal later surfaces of the frame, as well as an overlap region of an internal top surface of the frame. The second covering can be configured cover a majority of the surface area of the internal top surface of the frame, where it abuts the first covering along an annular region.
Abstract:
A durable, accessory cover assembly for a computing device, such as a cellular phone or a tablet computer. The accessory cover includes a frame, a first covering portion, and a second covering portion. The first covering can be composed of a wear-resistant material, such as leather; whereas, the second covering can be composed of a pliable particulate-absorbing material, such as microfiber. The first covering can be configured to seamlessly cover an external bottom surface of the frame, four external lateral surfaces of the frame, and four internal later surfaces of the frame, as well as an overlap region of an internal top surface of the frame. The second covering can be configured cover a majority of the surface area of the internal top surface of the frame, where it abuts the first covering along an annular region.
Abstract:
The described embodiments relate to a method for embedding one or more electrical components in a flexible substrate. The method includes receiving a substrate of a flexible material, wherein the substrate includes a cosmetic surface and an opposing surface. The method further includes applying a carrier form to the substrate to create a carrier assembly, wherein the carrier form includes one or more positive images representative a design to be transferred to the opposing surface of the substrate. The method further includes removing or cutting a portion of material from the opposing surface of the substrate to form a new opposing surface. Subsequently, the carrier form is removed from the substrate to reveal one or more embedding cavities extending into the substrate at the new opposing surface. In some embodiments, the embedding cavities can thereafter receive one or more electrical components.