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    Electronic Devices With Rearward-Facing Sensors
    1.
    发明公开
    Electronic Devices With Rearward-Facing Sensors 审中-公开

    公开(公告)号：US20240027753A1

    公开(公告)日：2024-01-25

    申请号：US18335671

    申请日：2023-06-15

    Applicant: Apple Inc.

    Inventor： Michael J. Oudenhoven ,  Brian S. Lau ,  Cameron A. Harder ,  Depeng Wang ,  Vikrant Bhakta

    IPC: G02B27/00 ,  G02B17/08 ,  G06F3/01 ,  G06F1/16

    CPC classification number: G02B27/0093 ,  G02B17/086 ,  G06F3/013 ,  G06F1/163

    Abstract: A head-mounted device may have a housing with a frame that supports lenses. Each lens may have a positive bias lens element and a negative bias lens element. A waveguide may overlap the lens. During operation, images from the waveguide may be provided to an eye box through the negative bias lens element. An eye sensor such as a gaze tracking camera may operate through the negative bias lens element. The negative bias lens element may have a protruding portion through which the sensor operates, may have a surface facing the sensor that has a curved surface to provide a desired lens characteristic, may have a prism for helping to couple light from the eye box to the eye sensor, and/or may have other features to facilitate use of the eye sensor to monitor the eye of a user in the eye box.

    Overmolded components having sub-flush residuals
    2.
    发明授权
    Overmolded components having sub-flush residuals 有权

    公开(公告)号：US11602055B2

    公开(公告)日：2023-03-07

    申请号：US16354646

    申请日：2019-03-15

    Applicant: Apple Inc.

    Inventor： Depeng Wang

    IPC: H05K3/28 ,  H05K3/00 ,  H05K5/00 ,  H01M10/42 ,  H05K1/02

    Abstract: Electronics modules according to embodiments of the present technology may include a circuit board having a first surface from which an electronic component extends and a second surface opposite the first surface. The circuit board may include a tie-bar residual extending from a sidewall of the circuit board beyond the width across the first surface. The modules may also include an overmold at least partially encapsulating the circuit board. The overmold may be characterized by a first height extending normal to the first surface of the circuit board across the width of the circuit board. The overmold may extend laterally beyond the width along a length of the first surface. The overmold may define a region about the tie-bar residual characterized by a recessed height. The overmold may define a notch recessed from an outer edge of the overmold. The notch may be located across the tie-bar residual.

    BATTERY WITH LAMINATED ELECTRODE TAB
    3.
    发明申请
    BATTERY WITH LAMINATED ELECTRODE TAB 有权

    公开(公告)号：US20250112340A1

    公开(公告)日：2025-04-03

    申请号：US18375990

    申请日：2023-10-02

    Applicant: Apple Inc.

    Inventor： Depeng Wang ,  Angus S. Smith ,  Hirotsugu Oba ,  Junhua Liu

    IPC: H01M50/534 ,  H01M50/533

    Abstract: A battery, comprising a battery can housing defining an opening, an electrode stack housed within the battery can housing, an internal electrode tab disposed within the interior volume. The internal electrode tab includes a conductive layer and an insulated lamination layer on the conductive layer, the conductive layer is electrically coupled to the electrode stack, and the insulated lamination layer is positioned between the conductive layer and the enclosure. An external electrode tab is electrically coupled to the conductive layer and positioned within the opening.

    OVERMOLDED COMPONENTS HAVING SUB-FLUSH RESIDUALS
    5.
    发明申请
    OVERMOLDED COMPONENTS HAVING SUB-FLUSH RESIDUALS 审中-公开

    公开(公告)号：US20200077522A1

    公开(公告)日：2020-03-05

    申请号：US16354646

    申请日：2019-03-15

    Applicant: Apple Inc.

    Inventor： Depeng Wang

    IPC: H05K3/28 ,  H05K3/00 ,  H05K1/02 ,  H05K5/00 ,  H01M10/42

    Abstract: Electronics modules according to embodiments of the present technology may include a circuit board having a first surface from which an electronic component extends and a second surface opposite the first surface. The circuit board may include a tie-bar residual extending from a sidewall of the circuit board beyond the width across the first surface. The modules may also include an overmold at least partially encapsulating the circuit board. The overmold may be characterized by a first height extending normal to the first surface of the circuit board across the width of the circuit board. The overmold may extend laterally beyond the width along a length of the first surface. The overmold may define a region about the tie-bar residual characterized by a recessed height. The overmold may define a notch recessed from an outer edge of the overmold. The notch may be located across the tie-bar residual.

    Overmolded components having sub-flush residuals
    7.
    发明授权
    Overmolded components having sub-flush residuals 有权

    公开(公告)号：US12156345B2

    公开(公告)日：2024-11-26

    申请号：US18116781

    申请日：2023-03-02

    Applicant: Apple Inc.

    Inventor： Depeng Wang

    IPC: H05K3/28 ,  H01M10/42 ,  H05K1/02 ,  H05K3/00 ,  H05K5/00

    Abstract: A circuit module may include a circuit board and an overmold. The circuit board may have a first surface from which an electronic component extends and a second surface opposite the first surface. The circuit board may be characterized by a width across the circuit board. The circuit board may include a tie-bar residual extending from a sidewall of the circuit board beyond the width across the circuit board. The overmold may at least partially encapsulate the first surface of the circuit board and the second surface of the circuit board. The overmold may extend laterally beyond the width of the circuit board along a length of the circuit board. The overmold may define a region about the tie-bar residual characterized by a first recessed height with respect to the first surface and a second recessed height with respect to the second surface. The overmold may define a notch within the region recessed from an outer edge of the overmold.

    DIRECT PLACEMENT BATTERY PACK MODULES
    8.
    发明申请
    DIRECT PLACEMENT BATTERY PACK MODULES 审中-公开

    公开(公告)号：US20190260007A1

    公开(公告)日：2019-08-22

    申请号：US15981420

    申请日：2018-05-16

    Applicant: Apple Inc.

    Inventor： Depeng Wang ,  Thai T. Ton ,  Nathan J. Bohney ,  George V. Anastas

    IPC: H01M2/26 ,  H01M10/42

    Abstract: Battery systems according to embodiments of the present technology may include a battery cell having an electrode tab extending from an edge of a first side of the battery cell. The battery system may also include a module electrically coupled with the battery cell. The module may include a mold defining a recess along a first side of the module. The module may also include a conductive tab extending from the first side of the module. The conductive tab may be coupled with the electrode tab. The electrode tab may be characterized by a curvature along a length of the electrode tab, and a distal end of the electrode tab may be positioned within the recess defined by the mold.

    OVERMOLDED COMPONENTS HAVING SUB-FLUSH RESIDUALS
    9.
    发明公开
    OVERMOLDED COMPONENTS HAVING SUB-FLUSH RESIDUALS 审中-公开

    公开(公告)号：US20230209723A1

    公开(公告)日：2023-06-29

    申请号：US18116781

    申请日：2023-03-02

    Applicant: Apple Inc.

    Inventor： Depeng Wang

    IPC: H05K3/28 ,  H05K3/00 ,  H05K5/00 ,  H01M10/42 ,  H05K1/02

    CPC classification number: H05K3/28 ,  H05K3/0097 ,  H05K3/0026 ,  H05K3/0052 ,  H05K5/0034 ,  H01M10/425 ,  H05K1/0284 ,  H01M2010/4271 ,  H05K2203/107 ,  H05K2203/1327

    Abstract: A circuit module may include a circuit board and an overmold. The circuit board may have a first surface from which an electronic component extends and a second surface opposite the first surface. The circuit board may be characterized by a width across the circuit board. The circuit board may include a tie-bar residual extending from a sidewall of the circuit board beyond the width across the circuit board. The overmold may at least partially encapsulate the first surface of the circuit board and the second surface of the circuit board. The overmold may extend laterally beyond the width of the circuit board along a length of the circuit board. The overmold may define a region about the tie-bar residual characterized by a first recessed height with respect to the first surface and a second recessed height with respect to the second surface. The overmold may define a notch within the region recessed from an outer edge of the overmold.

    Direct placement battery pack modules
    10.
    发明授权
    Direct placement battery pack modules 有权

    公开(公告)号：US10985358B2

    公开(公告)日：2021-04-20

    申请号：US15981420

    申请日：2018-05-16

    Applicant: Apple Inc.

    Inventor： Depeng Wang ,  Thai T. Ton ,  Nathan J. Bohney ,  George V. Anastas

    IPC: H01M2/26 ,  H01M10/42

    Abstract: Battery systems according to embodiments of the present technology may include a battery cell having an electrode tab extending from an edge of a first side of the battery cell. The battery system may also include a module electrically coupled with the battery cell. The module may include a mold defining a recess along a first side of the module. The module may also include a conductive tab extending from the first side of the module. The conductive tab may be coupled with the electrode tab. The electrode tab may be characterized by a curvature along a length of the electrode tab, and a distal end of the electrode tab may be positioned within the recess defined by the mold.

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