公开(公告)号：US20250112189A1

公开(公告)日：2025-04-03

申请号：US18673101

申请日：2024-05-23

Applicant: Apple Inc.

Inventor： Nicolas Hotellier ,  Christophe Verove ,  Amaud Laflaquiere ,  David Coulon ,  Siddharth Joshi ,  Stephane Zoll ,  Keith Lyon ,  Cristiano L. Niclass

IPC: H01L23/00 ,  H01L27/146 ,  H01S5/183

Abstract: An electronic device includes a set of semiconductor layers defining a set of semiconductor mesas. A first dielectric abuts the set of semiconductor layers at a perimeter of the set of semiconductor layers. A second dielectric is disposed on the set of semiconductor mesas. A set of conductors is routed in or on the second dielectric. The set of conductors is electrically connected to at least one active device defined in at least one semiconductor mesa of the set of semiconductor mesas. The set of conductors is configured to route electrical signals to or from the at least one semiconductor mesa, and the set of conductors includes a set of hybrid bonding pads on the second dielectric.

公开(公告)号：US20240079440A1

公开(公告)日：2024-03-07

申请号：US17903067

申请日：2022-09-06

Applicant: Apple Inc.

Inventor： Oray O. Cellek ,  Fei Tan ,  Gershon Rosenblum ,  Hong Wei Lee ,  Cheng-Ying Tsai ,  Jae Y. Park ,  Christophe Verove ,  John L Orlowski ,  Siddharth Joshi ,  Xiangli Li ,  David Coulon ,  Xiaofeng Fan ,  Keith Lyon ,  Nicolas Hotellier ,  Arnaud Laflaquière

IPC: H01L27/146 ,  H04N5/378

CPC classification number: H01L27/14652 ,  H01L27/14621 ,  H01L27/14636 ,  H01L27/1465 ,  H04N5/378

Abstract: A multispectral sensing device includes a first die, including silicon, which is patterned to define a first array of sensor elements, which output first electrical signals in response to optical radiation that is incident on the device in a band of wavelengths less than 1000 nm that is incident on the front side of the first die. A second die has its first side bonded to the back side of the first die and includes a photosensitive material and is patterned to define a second array of sensor elements, which output second electrical signals in response to the optical radiation that is incident on the device in a second band of wavelengths greater than 1000 nm that passes through the first die and is incident on the first side of the second die. Readout circuitry reads the first electrical signals and the second electrical signals serially out of the device.