公开(公告)号：US20230262375A1

公开(公告)日：2023-08-17

申请号：US18138533

申请日：2023-04-24

申请人： Apple Inc.

发明人： Jason Joseph LeBlanc ,  Rohan Gupta ,  Robert D. Zupke ,  Todd K. Moyer ,  Cuneyt Bakan ,  Brooke L. Bunney ,  Justin T. Ng ,  Jeff A. Kalt ,  Tian Shi Li ,  Lionel B. Barrow

IPC分类号： H04R1/10

CPC分类号： H04R1/1041 ,  H04R1/1091 ,  H04R1/1066

摘要： A detachable headband for a headphone system can incorporate a headband identification circuit that stores or encodes a headband identification parameter value. When the headband becomes attached to an ear cup, the headband can transmit the headband identification parameter value to the ear cup.

公开(公告)号：US11665462B1

公开(公告)日：2023-05-30

申请号：US17447895

申请日：2021-09-16

申请人： Apple Inc.

发明人： Jason Joseph LeBlanc ,  Rohan Gupta ,  Robert D. Zupke ,  Todd K. Moyer ,  Cuneyt Bakan ,  Brooke L. Bunney ,  Justin T. Ng ,  Jeff A. Kalt ,  Tian Shi Li ,  Lionel B. Barrow

IPC分类号： H04R1/10

CPC分类号： H04R1/1041 ,  H04R1/1066 ,  H04R1/1091

摘要： A detachable headband for a headphone system can incorporate a headband identification circuit that stores or encodes a headband identification parameter value. When the headband becomes attached to an ear cup, the headband can transmit the headband identification parameter value to the ear cup.

公开(公告)号：US09825410B2

公开(公告)日：2017-11-21

申请号：US15260271

申请日：2016-09-08

申请人： Apple Inc.

发明人： Robert Scritzky ,  John Raff ,  Cuneyt Bakan ,  Eric T. SooHoo ,  Erik A. Uttermann ,  Patrick J. Quinn

IPC分类号： H01R13/66 ,  H01R13/658 ,  H01R24/60 ,  H01R24/62 ,  H01R12/75 ,  H01R13/405 ,  H01R13/6477

CPC分类号： H01R13/665 ,  H01R12/714 ,  H01R12/75 ,  H01R13/405 ,  H01R13/6477 ,  H01R13/658 ,  H01R13/6582 ,  H01R13/6594 ,  H01R24/60 ,  H01R24/62 ,  H01R27/00 ,  H01R31/065

摘要： Connector receptacles, examples of which comprise a housing having a first plurality of slots in a top side and a second plurality of slots in a bottom side, a top row of contacts positioned in the first plurality of slots in the housing, a bottom row of contacts positioned in the second plurality of slots in the housing, a top shell portion over the top of the housing, the top shell portion comprising first and second electromagnetic contacts extending from a front of the top shell and passing through openings in the top side of the housing, and a bottom shell portion under the bottom of the housing, the bottom shell portion comprising third and fourth electromagnetic contacts extending from a front of the bottom shell and passing through openings in the bottom side of the housing.

公开(公告)号：US20170133799A1

公开(公告)日：2017-05-11

申请号：US15260271

申请日：2016-09-08

申请人： Apple Inc.

发明人： Robert Scritzky ,  John Raff ,  Cuneyt Bakan ,  Eric T. SooHoo ,  Erik A. Uttermann ,  Patrick J. Quinn

IPC分类号： H01R13/66 ,  H01R24/60 ,  H01R13/6477 ,  H01R12/75 ,  H01R13/405 ,  H01R13/658 ,  H01R24/62

CPC分类号： H01R13/665 ,  H01R12/714 ,  H01R12/75 ,  H01R13/405 ,  H01R13/6477 ,  H01R13/658 ,  H01R13/6582 ,  H01R13/6594 ,  H01R24/60 ,  H01R24/62 ,  H01R27/00 ,  H01R31/065

摘要： Connector receptacles that may have a desired form factor to fit in a stylized device enclosure. These stylized connector receptacles and corresponding connector inserts may also be capable of high-speed performance. Examples may also provide circuitry for these connector inserts and connector receptacles that support these high speeds.