公开(公告)号：US10811192B2

公开(公告)日：2020-10-20

申请号：US16146042

申请日：2018-09-28

Applicant: Apple Inc.

Inventor： Paul A. Martinez ,  Won Seop Choi ,  Gang Ning ,  Chirag V. Shah ,  Martin Schauer ,  Curtis C. Mead ,  Ming Yuan Tsai ,  Albert Wang

IPC: H01G4/005 ,  H01G4/12 ,  H01G4/228 ,  H01G4/30

Abstract: Multilayer ceramic capacitor structures may include structural arrangements, materials, and/or substrate modifications that can improve the reliability of the capacitor for long-term usage when faced with environmental stress. Embodiments may implement reduced entryways in the termination patterns of the capacitor to decrease damage potential due to exposure of moisture. Embodiments may implement structures that decrease interfaces with different physical characteristics, which may lead to a reduction in the formation of micro-fractures during regular usage. Methods of manufacture for the features that improve reliability are also detailed.

公开(公告)号：US20200105473A1

公开(公告)日：2020-04-02

申请号：US16146042

申请日：2018-09-28

Applicant: Apple Inc.

Inventor： Paul A. Martinez ,  Won Seop Choi ,  Gang Ning ,  Chirag V. Shah ,  Martin Schauer ,  Curtis C. Mead ,  Ming Yuan Tsai ,  Albert Wang

IPC: H01G4/30 ,  H01G4/12 ,  H01G4/005 ,  H01G4/228

Abstract: Multilayer ceramic capacitor structures may include structural arrangements, materials, and/or substrate modifications that can improve the reliability of the capacitor for long-term usage when faced with environmental stress. Embodiments may implement reduced entryways in the termination patterns of the capacitor to decrease damage potential due to exposure of moisture. Embodiments may implement structures that decrease interfaces with different physical characteristics, which may lead to a reduction in the formation of micro-fractures during regular usage. Methods of manufacture for the features that improve reliability are also detailed.