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公开(公告)号：US20220361336A1
公开(公告)日：2022-11-10
申请号：US17314131
申请日：2021-05-07
发明人： Cheng-Neng Chen , Sui-Ho Tsai , Yun-Nan Wang , Chiao-Hui Wang
IPC分类号： H05K1/14 , C23C14/34 , C23C18/16 , C25D5/02 , C25D5/10 , G03F7/004 , G03F7/20 , C23C28/02 , C23C14/58
摘要： A metal circuit structure based on a flexible printed circuit (FPC) contains: a substrate, a first metal layer attached on the substrate, a second metal layer formed on the first metal layer, and an intermediate layer defined between the first metal layer and the second metal layer. A first surface of the intermediate layer is connected with the first metal layer, and a second surface of the intermediate layer is connected with the second metal layer. The intermediate layer is made of a first material, the second metal layer is made of a second material, and the first material of the intermediate layer does not act with the second material of the second metal layer.
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公开(公告)号：US11406018B1
公开(公告)日：2022-08-02
申请号：US17181039
申请日：2021-02-22
发明人： Sui-Ho Tsai , Cheng-Neng Chen , Yun-Nan Wang , Chih-Yuan Chao , Hsueh-Tsung Lu
摘要： A double-sided and multilayer flexible printed circuit (FPC) substrate contains: a body, multiple tilted vias passing through the body, a sputtering layer, multiple conductive portions, and multiple copper circuit layers. The sputtering layer is adhered on the body and the multiple tilted vias. A respective conductive portion is formed in a respective titled via and is connected with the sputtering layer. The multiple copper circuit layers are located on a top and a bottom of the body and are connected with the sputtering layer, and the multiple copper circuit layers are connected via the multiple conductive portions.
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公开(公告)号：US12089331B2
公开(公告)日：2024-09-10
申请号：US17314131
申请日：2021-05-07
发明人： Cheng-Neng Chen , Sui-Ho Tsai , Yun-Nan Wang , Chiao-Hui Wang
IPC分类号： H05K1/14 , C23C14/34 , C23C14/58 , C23C18/16 , C23C28/02 , C25D5/02 , C25D5/10 , G03F7/004 , G03F7/20 , H05K1/11
CPC分类号： H05K1/147 , C23C14/34 , C23C14/5873 , C23C18/1637 , C23C28/023 , C25D5/022 , C25D5/10 , G03F7/0041 , G03F7/2016 , H05K1/11 , H05K2201/032 , H05K2201/0338 , H05K2201/0341
摘要： A metal circuit structure based on a flexible printed circuit (FPC) contains: a substrate, a first metal layer attached on the substrate, a second metal layer formed on the first metal layer, and an intermediate layer defined between the first metal layer and the second metal layer. A first surface of the intermediate layer is connected with the first metal layer, and a second surface of the intermediate layer is connected with the second metal layer. The intermediate layer is made of a first material, the second metal layer is made of a second material, and the first material of the intermediate layer does not act with the second material of the second metal layer.
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公开(公告)号：US20220272840A1
公开(公告)日：2022-08-25
申请号：US17181039
申请日：2021-02-22
发明人： Sui-Ho Tsai , Cheng-Neng Chen , Yun-Nan Wang , Chih-Yuan Chao , Hsueh-Tsung Lu
摘要： A double-sided and multilayer flexible printed circuit (FPC) substrate contains: a body, multiple tilted vias passing through the body, a sputtering layer, multiple conductive portions, and multiple copper circuit layers. The sputtering layer is adhered on the body and the multiple tilted vias. A respective conductive portion is formed in a respective titled via and is connected with the sputtering layer. The multiple copper circuit layers are located on a top and a bottom of the body and are connected with the sputtering layer, and the multiple copper circuit layers are connected via the multiple conductive portions.
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