公开(公告)号：US20180130867A1

公开(公告)日：2018-05-10

申请号：US15347724

申请日：2016-11-09

Applicant: Analog Devices Global

Inventor： Paul Lambkin ,  Michal J. Osiak ,  Brian Anthony Moane ,  Stephen O'Brien ,  Laurence Brendan O'Sullivan ,  Patrick J. Murphy ,  Patrick M. McGuinness ,  Bernard P. Stenson

IPC: H01L49/02 ,  H01F27/28 ,  H01F41/04

CPC classification number: H01L28/10 ,  H01F27/2804 ,  H01F27/2885 ,  H01F27/323 ,  H01F41/041 ,  H01F41/042 ,  H01F41/122 ,  H01F2019/085 ,  H01F2027/2809 ,  H01F2027/2819 ,  H01L23/5227

Abstract: A magnetic isolator is described. The magnetic isolator may comprise a top conductive coil, a bottom conductive coil, and a dielectric layer separating the top conductive coil from the bottom conductive coil. The top conductive coil may comprise an outermost portion having multiple segments. The segments may be configured to reduce the peak electric field in a region of the dielectric layer near the outer edge of the top conductive coil. The top conductive coil may comprise a first lateral segment, and a second lateral segment that is laterally offset with respect to the first lateral segment. The first lateral segment may be closer to the center of the top conductive coil than the second lateral segment, and may be closer to the bottom conductive coil than the second lateral segment. The magnetic isolator may be formed using microfabrication techniques.

公开(公告)号：US09929038B2

公开(公告)日：2018-03-27

申请号：US13788410

申请日：2013-03-07

Applicant: Analog Devices Global

Inventor： Laurence Brendan O'Sullivan

IPC: H01L21/70 ,  H01L21/762 ,  H01L29/06 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50

CPC classification number: H01L21/762 ,  H01L23/3114 ,  H01L23/49575 ,  H01L23/50 ,  H01L29/0649 ,  H01L2224/05553 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49107 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of forming an insulating structure, comprising forming an insulating region comprising at least one electrical or electronic component or part thereof embedded within the insulating region, and forming a surface structure in a surface of the insulating region.