公开(公告)号：US20220246542A1

公开(公告)日：2022-08-04

申请号：US17725260

申请日：2022-04-20

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Ji Young CHUNG ,  Jae Ho LEE ,  Byong Il HEO

IPC分类号： H01L23/552 ,  H01L23/538 ,  H01L23/31 ,  H01L23/00 ,  H01L25/00 ,  H01L21/48 ,  H01L21/56 ,  H01L25/065 ,  H01L23/498

摘要： In one example, an electronic device structure includes a substrate having a conductive structure adjacent to a surface. The conductive structure can include a plurality of conductive traces. First and second electronic devices are disposed adjacent to the top surface. The first electronic device is interposed between a first conductive trace and a second conductive trace, and the second electronic device is interposed between the second conductive trace and a third conductive trace. A continuous wire structure including a first bond structure is connected to the first conductive trace, a second bond structure is connected to the second conductive trace, a third bond structure is connected to the third conductive trace, a first wire portion is interconnected between the first bond structure and the second bond structure and disposed to overlie the first electronic device, and a second wire portion is interconnected between the second bond structure and the third bond structure and disposed to overlie the second electronic device. Other examples and related methods are also disclosed herein.