公开(公告)号：US09702577B1

公开(公告)日：2017-07-11

申请号：US14749515

申请日：2015-06-24

Applicant: Amazon Technologies, Inc.

Inventor： Alan Joseph Lachapelle ,  Matthew Thomas Phillips ,  Shawn Duane Patrick ,  Michael Steven Greer ,  Taslim A. Abdul Salam

IPC: B01D46/44 ,  B01D46/46 ,  F24F11/00

CPC classification number: F24F11/0001 ,  B01D46/446 ,  F24F11/30 ,  F24F11/39 ,  F24F11/62 ,  F24F11/64 ,  F24F11/77 ,  F24F2110/00 ,  F24F2110/40

Abstract: An updated operating speed for a fan of an air handler may be determined. The updated operating speed may depend on a target output volume for the air handler and an intermediate resistance value for a filter of the air handler. The intermediate resistance value may be determined by instructing the fan to operate at a first operating speed for a fixed period of time. During the fixed period of time, a pressure sensing system may sense an observed differential pressure measured across the filter. The observed differential pressure may correspond to the intermediate resistance value. The intermediate resistance value may be used to identify, from a set of filter loading values which may be retained in a filter loading data structure, the updated operating speed for the fan such that the air handler is capable of achieving the target output volume.

公开(公告)号：US10433454B1

公开(公告)日：2019-10-01

申请号：US14495216

申请日：2014-09-24

Applicant: Amazon Technologies, Inc.

Inventor： Giorgio Arturo Pompei ,  Frank Andrew Glynn ,  Shawn Duane Patrick

IPC: H05K7/20 ,  E04F15/024

Abstract: An isolated work space is created within a confined area used as an airflow plenum to inhibit the spread of debris and/or contamination. For example, a work area can be formed in an under-floor space of a datacenter. Forming the work area includes erecting an airflow barrier to surround a work area portion of the under-floor space, forming a lower-perimeter seal to seal a bottom edge of the airflow barrier, forming an upper-perimeter seal to seal a top edge of the airflow barrier, operatively connecting a vacuum source with the work area portion, and operating the vacuum source to reduce the air pressure within the work area portion relative to the remaining portion of the under-floor space.

公开(公告)号：US10299410B1

公开(公告)日：2019-05-21

申请号：US14722016

申请日：2015-05-26

Applicant: Amazon Technologies, Inc.

Inventor： Shawn Duane Patrick ,  Frank Andrew Glynn ,  Alan Joseph Lachapelle ,  Giorgio Arturo Pompei

IPC: H05K7/20

Abstract: A modular cooling apparatus for cooling one or more rack-mounted electronic component enclosures in a datacenter includes a base duct section and a duct assembly. The base duct section includes an inlet to receive a cooling airflow and an outlet to transfer to the cooling airflow to the duct assembly. The duct assembly is connected to the base duct section. The duct assembly includes one or more modular duct sections. Each of the one or more modular duct sections has a vent and is configured such that the vent aligns with an exterior opening in the respective one of the one or more electronic component enclosures.