公开(公告)号：US20220363792A1

公开(公告)日：2022-11-17

申请号：US17728900

申请日：2022-04-25

Applicant: Align Technology, Inc.

Inventor： Umesh Upendra Choudhary ,  Jessica Kalay Su ,  Michael Christopher Cole ,  Jennifer Marie Chavez

IPC: C08F220/12

Abstract: Provided herein are curable compositions for use in a high temperature lithography-based photopolymerization process, and telechelic block polymers and methods of using such polymers in curable compositions to produce medical devices such as orthodontic appliances comprising the polymeric compositions comprising the telechelic block polymers.

公开(公告)号：US12297309B2

公开(公告)日：2025-05-13

申请号：US18590453

申请日：2024-02-28

Applicant: Align Technology, Inc.

Inventor： Jessica Kalay Su

IPC: A61C7/08 ,  A61C7/00 ,  B33Y70/00 ,  B33Y80/00 ,  C08F297/02 ,  C09D153/00

Abstract: The present disclosure provides micelles comprising a plurality of block co-polymers, the micelle comprising (i) a core comprising at least a portion of a poly(alkyl acrylate) block of one or more of the block co-polymers; and (ii) an outer layer comprising at least a portion of a poly(aryl acrylate) block or a poly(aryl methacrylate) block of one or more of the block co-polymers. The present disclosure also includes polymer compositions, polymer films, and devices (e.g., orthodontic equipment) including the same. Methods for making and using micelles, polymer compositions, polymer films, and devices (e.g., orthodontic equipment) are also disclosed. Further provided herein are methods of producing polymer compositions and using the same for the fabrication (e.g., via 3D printing) of medical devices, such as orthodontic appliances.

公开(公告)号：US12049528B2

公开(公告)日：2024-07-30

申请号：US17728900

申请日：2022-04-25

Applicant: Align Technology, Inc.

Inventor： Umesh Upendra Choudhary ,  Jessica Kalay Su ,  Michael Christopher Cole ,  Jennifer Marie Chavez

IPC: C08F2/46 ,  C08F2/50 ,  C08F220/12 ,  C08F220/30 ,  C08G61/04 ,  A61C7/00 ,  B33Y70/00 ,  B33Y80/00

CPC classification number: C08F220/12 ,  C08F2/50 ,  C08F220/301 ,  C08F220/302 ,  A61C7/00 ,  B33Y70/00 ,  B33Y80/00

Abstract: Provided herein are curable compositions for use in a high temperature lithography-based photopolymerization process, and telechelic block polymers and methods of using such polymers in curable compositions to produce medical devices such as orthodontic appliances comprising the polymeric compositions comprising the telechelic block polymers.