公开(公告)号：US20230402416A1

公开(公告)日：2023-12-14

申请号：US17839469

申请日：2022-06-13

申请人： Airoha Technology (HK) Limited

发明人： Huan-Sheng Chen ,  Ming-Yin Ko ,  Chun-Wei Chen

IPC分类号： H01L23/00 ,  H01F17/00

CPC分类号： H01L24/09 ,  H01L24/48 ,  H01F17/0006 ,  H01L2924/30107 ,  H01L2224/0901 ,  H01L2224/0912 ,  H01L2924/19042 ,  H01L2224/48227 ,  H01L2924/30105 ,  H01F2017/0086

摘要： A semiconductor die includes a processing circuit, a first bond pad, and a second bond pad. The first bond pad is electrically connected to a first node of the processing circuit and a first bond wire. The second bond pad is electrically connected to a second node of the processing circuit and a second bond wire. The first bond wire and the second bond wire are magnetically coupled to form a first bond wire T-coil circuit with equivalent negative inductance.

公开(公告)号：US20230238349A1

公开(公告)日：2023-07-27

申请号：US17832721

申请日：2022-06-06

申请人： Airoha Technology (HK) Limited

发明人： Chun-Wei Chen ,  Yan-Bin Luo ,  Ming-Yin Ko

IPC分类号： H01L23/00 ,  H01L23/498

CPC分类号： H01L24/32 ,  H01L24/73 ,  H01L24/48 ,  H01L24/29 ,  H01L23/49833 ,  H01L23/49811 ,  H01L2924/1204 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73265 ,  H01L2224/48225 ,  H01L2224/32057 ,  H01L2924/0781

摘要： A semiconductor package includes a printed circuit board (PCB), a semiconductor device, an interposer, and a conductive adhesive. The PCB has a top surface with at least one ground area formed thereon. The semiconductor device has a bottom surface with at least one first first-type contact formed thereon. The interposer is located between the semiconductor device and the PCB. The bottom surface of the semiconductor device is adhered to a top surface of the interposer by the conductive adhesive. The conductive adhesive overflows from an edge of the top surface of the interposer to have contact with the at least one ground area on the top surface of the PCB.