- 专利标题： SEMICONDUCTOR DIE WITH PECULIAR BOND PAD ARRANGEMENT FOR LEVERAGING MUTUAL INDUCTANCE BETWEEN BOND WIRES TO REALIZE BOND WIRE T-COIL CIRCUIT WITH EQUIVALENT NEGATIVE INDUCTANCE
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申请号： US17839469申请日： 2022-06-13
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公开(公告)号： US20230402416A1公开(公告)日： 2023-12-14
- 发明人: Huan-Sheng Chen , Ming-Yin Ko , Chun-Wei Chen
- 申请人： Airoha Technology (HK) Limited
- 申请人地址： HK NORTH POINT
- 专利权人： Airoha Technology (HK) Limited
- 当前专利权人： Airoha Technology (HK) Limited
- 当前专利权人地址： HK NORTH POINT
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01F17/00
摘要：
A semiconductor die includes a processing circuit, a first bond pad, and a second bond pad. The first bond pad is electrically connected to a first node of the processing circuit and a first bond wire. The second bond pad is electrically connected to a second node of the processing circuit and a second bond wire. The first bond wire and the second bond wire are magnetically coupled to form a first bond wire T-coil circuit with equivalent negative inductance.
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