专利检索 ap:("Advanced Semiconductor Engineering, Inc.") AND inv:"Yuan-Tzuo Luo" 第 1 页

1.

发明授权
Package structure and method for manufacturing the same 有权

公开(公告)号：US11244909B2

公开(公告)日：2022-02-08

申请号：US16817407

申请日：2020-03-12

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Fan-Yu Min , Chen-Hung Lee , Wei-Hang Tai , Yuan-Tzuo Luo , Wen-Yuan Chuang , Chun-Cheng Kuo , Chin-Li Kao

IPC分类号： H01L23/00 , H01L23/16 , H01L23/31 , H01L23/538 , H01L21/48 , H01L21/56

摘要： A package structure and a manufacturing method are provided. The package structure includes a wiring structure, a first electronic device and a second electronic device. The first electronic device is disposed on the wiring structure. The second electronic device is disposed on the wiring structure. The first electronic device and the second electronic device are disposed side by side. A gap between the first electronic device and the second electronic device is greater than or equal to about 150 μm.