公开(公告)号：US11792565B2

公开(公告)日：2023-10-17

申请号：US17242060

申请日：2021-04-27

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih Lung Lin ,  Kuei-Hao Tseng ,  Kai Hung Wang

IPC: H04R1/24 ,  H04R1/40 ,  H04R3/12 ,  H04R1/26

CPC classification number: H04R1/403 ,  H04R1/24 ,  H04R1/26 ,  H04R3/12 ,  H04R2201/405 ,  H04R2430/20

Abstract: An electronic module is provided. The electronic module includes a first transducer and a second transducer. The first transducer is configured to radiate a first ultrasonic wave. The second transducer is configured to radiate a second ultrasonic wave. A location of the first transducer is configured to be adjustable with respect to the second transducer.

公开(公告)号：US11582553B2

公开(公告)日：2023-02-14

申请号：US17242093

申请日：2021-04-27

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih Lung Lin ,  Kuei-Hao Tseng ,  Kai Hung Wang

IPC: H04R1/40 ,  H04R1/26 ,  H04R3/12 ,  G02C11/00 ,  H04R1/24

Abstract: An electronic module is provided. The electronic module includes a first transducer and a second transducer. The first transducer is configured to radiate a first ultrasonic wave. The second transducer is configured to radiate a second ultrasonic wave. The first transducer and the second transducer are disposed on noncoplanar surfaces.

公开(公告)号：US12245872B2

公开(公告)日：2025-03-11

申请号：US17244876

申请日：2021-04-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih Lung Lin ,  Kuei-Hao Tseng ,  Te Kao Tsui ,  Kai Hung Wang ,  Hung-I Lin

IPC: A61B5/00 ,  H05K1/02 ,  A61B5/024 ,  A61B5/0531 ,  A61B5/145 ,  A61B5/318 ,  A61B5/369 ,  A61B5/389 ,  A61B5/398

Abstract: The present disclosure provides an electronic device. The electronic device includes a flexible element, and a sensing element adjacent to the flexible element and configured to detect a biosignal. The electronic device also includes an active component in the flexible element and electrically connected with the sensing element. A method of manufacturing an electronic device is also disclosed.

公开(公告)号：US11985479B2

公开(公告)日：2024-05-14

申请号：US18109792

申请日：2023-02-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih Lung Lin ,  Kuei-Hao Tseng ,  Kai Hung Wang

IPC: H04R1/40 ,  G02C11/00 ,  H04R1/24 ,  H04R1/26 ,  H04R3/12

CPC classification number: H04R1/403 ,  G02C11/10 ,  H04R1/24 ,  H04R1/26 ,  H04R3/12 ,  H04R2201/401

Abstract: An electronic module is provided. The electronic module includes a first transducer and a second transducer. The first transducer is configured to radiate a first ultrasonic wave. The second transducer is configured to radiate a second ultrasonic wave. The first transducer and the second transducer are disposed on noncoplanar surfaces.