公开(公告)号：US11315883B2

公开(公告)日：2022-04-26

申请号：US16680978

申请日：2019-11-12

Applicant: Advanced Micro Devices, Inc. ,  ATI Technologies ULC

Inventor： Suming Hu ,  Roden Topacio ,  Farshad Ghahghahi ,  Jianguo Li ,  Andrew Kwan Wai Leung

IPC: H01L23/544 ,  H01L23/18 ,  H01L23/12

Abstract: An apparatus includes a substrate including an identification code on a first side of the substrate and near a perimeter of the substrate. The apparatus includes a stiffener structure attached to the first side of the substrate. The stiffener structure has a cutout in an outer perimeter of the stiffener structure. The stiffener structure is oriented with respect to the substrate to cause the cutout to expose the identification code. The cutout may have a first dimension and a second dimension orthogonal to the first dimension. The first dimension may exceed a corresponding first dimension of the identification code and the second dimension may exceed a corresponding second dimension of the identification code, thereby forming a void region between the identification code and edges of the stiffener structure.

公开(公告)号：US20210143104A1

公开(公告)日：2021-05-13

申请号：US16680978

申请日：2019-11-12

Applicant: Advanced Micro Devices, Inc. ,  ATI Technologies ULC

Inventor： Suming Hu ,  Roden Topacio ,  Farshad Ghahghahi ,  Jianguo Li ,  Andrew Kwan Wai Leung

IPC: H01L23/544 ,  H01L23/18 ,  H01L23/12

Abstract: An apparatus includes a substrate including an identification code on a first side of the substrate and near a perimeter of the substrate. The apparatus includes a stiffener structure attached to the first side of the substrate. The stiffener structure has a cutout in an outer perimeter of the stiffener structure. The stiffener structure is oriented with respect to the substrate to cause the cutout to expose the identification code. The cutout may have a first dimension and a second dimension orthogonal to the first dimension. The first dimension may exceed a corresponding first dimension of the identification code and the second dimension may exceed a corresponding second dimension of the identification code, thereby forming a void region between the identification code and edges of the stiffener structure.

公开(公告)号：US11942405B2

公开(公告)日：2024-03-26

申请号：US17525424

申请日：2021-11-12

Applicant: ATI TECHNOLOGIES ULC

Inventor： Jianguo Li ,  Roden Topacio

IPC: H01L25/16 ,  H01L23/31 ,  H01L23/498 ,  H01L23/50 ,  H01L23/64

CPC classification number: H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/642 ,  H01L23/645 ,  H01L23/647 ,  H01L25/16

Abstract: A semiconductor package assembly includes a semiconductor package that includes a semiconductor chip bonded to a substrate. The assembly also includes a plurality of passive devices mounted on a bottom surface of the substrate opposite the semiconductor chip, the plurality of passive devices including a plurality of operable passive devices and a plurality of standoff passive devices, wherein a height of each of the plurality of standoff passive devices is greater than a height of any of the plurality of operable passive devices. The assembly also includes a plurality of solder structures attached to the bottom surface of the substrate. When mounted on a circuit board, the standoff passive devices prevent solder bridging.