-
公开(公告)号:US11742449B2
公开(公告)日:2023-08-29
申请号:US17871712
申请日:2022-07-22
申请人: Adaps Photonics Inc.
发明人: Ching-Ying Lu , Yangsen Kang , Shuang Li , Kai Zang
IPC分类号: H01L31/10 , H01L31/107 , H01L31/02 , H01L27/146 , C30B25/18 , H04N25/76
CPC分类号: H01L31/107 , C30B25/18 , H01L27/14636 , H01L31/02027 , H04N25/76
摘要: The present invention provides a single photon avalanche diode device. The device has a logic substrate comprising an upper surface. The device has a sensor substrate bonded to an upper surface of the logic substrate. In an example, the sensor substrate comprises a plurality of pixel elements spatially disposed to form an array structure. In an example, each of the pixel elements has a passivation material, an epitaxially grown silicon material, an implanted p-type material configured in a first portion of the epitaxially grown material, an implanted n-type material configured in a second portion of the epitaxially grown material, and a junction region configured from the implanted p-type material and the implanted n-type material.
-
公开(公告)号:US11508867B2
公开(公告)日:2022-11-22
申请号:US16775101
申请日:2020-01-28
申请人: Adaps Photonics Inc.
发明人: Ching-Ying Lu , Yangsen Kang , Shuang Li , Kai Zang
IPC分类号: H01L31/10 , H01L31/107 , H01L31/02 , H01L27/146 , H04N5/374 , C30B25/18
摘要: The present invention provides a single photon avalanche diode device. The device has a logic substrate comprising an upper surface. The device has a sensor substrate bonded to an upper surface of the logic substrate. In an example, the sensor substrate comprises a plurality of pixel elements spatially disposed to form an array structure. In an example, each of the pixel elements has a passivation material, an epitaxially grown silicon material, an implanted p-type material configured in a first portion of the epitaxially grown material, an implanted n-type material configured in a second portion of the epitaxially grown material, and a junction region configured from the implanted p-type material and the implanted n-type material.
-